LED Thermal Dissipation in Induction Hob Coil Assembly
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Solution Overview
Problem
Existing induction cooking hobs with illumination equipment face challenges in reliable heat dissipation from light emitting diodes, leading to potential overheating and assembly complexities.
Innovation Solution
A high-power light emitting diode is mounted to the center of the induction coil unit with a spring element providing thermal conductive contact to the chassis, forming a single assembly unit, which enhances thermal dissipation and simplifies assembly by reducing the number of parts and avoiding adhesive connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a high-power light emitting diode is mounted to the chassis using adhesive tape, then thermal conductivity is provided, but assembly complexity increases and reliability decreases due to difficult detachment and potential overheating
Solution Approach 1:
The patent combines the light emitting diode mounting to the induction coil unit with the thermal conduction function by directly mounting the LED to the chassis through the induction coil unit, eliminating the need for separate adhesive tape mounting and creating a unified assembly that simplifies the overall structure while maintaining thermal conductivity
Solution Approach 2:
The induction coil unit serves as an intermediary component between the light emitting diode and the chassis, providing both mechanical support and thermal conduction path, thereby replacing the adhesive tape while maintaining the necessary thermal connection
2Adaptability or versatility
If multiple separate parts are used for mounting the light emitting diode, then flexibility is provided, but the number of parts increases and assembly time increases
Solution Approach 1:
The patent merges the light emitting diode, induction coil unit, and chassis into a single integrated assembly where the LED is directly mounted to the chassis through the coil unit, reducing the number of separate parts and simplifying the assembly workflow while maintaining mounting flexibility
3Temperature
If adhesive connections are used to mount the light emitting diode, then thermal conductivity is established, but ease of repair decreases due to difficult detachment
Solution Approach 1:
The patent extracts the adhesive tape from the mounting system and replaces it with a direct mechanical and thermal connection through the induction coil unit, allowing the light emitting diode to be removed and replaced without adhesive detachment issues while maintaining thermal conductivity through the chassis
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution improves heat dissipation, simplifies the assembly process, reduces tool costs, and allows for easier readjustment or replacement of induction coil units, while maintaining effective thermal conductivity through the use of materials like aluminum and silicone.
Implementation Method 1
Thermal conductive contact between the light emitting and the chassis is provided by a spring element pressing at least a surface of the light emitting diode onto the chassis
Implementation Method 2
a light emitting diode mounted to a center of the at least one induction coil unit
Data Source
AI summary
An induction cooking hob (1) with illumination equipment includes a cover element (2) arranged at the top side of the induction cooking hob and including at least one heating zone, a chassis (5) arranged below the cover element (2) and at least one induction coil unit (3) having an induction coil (10). The induction coil unit (3) is arranged below the at least one heating zone. According to the invention, a light emitting diode (4) is mounted to the center of the at least one induction coil unit (3). Thermal conductive contact between the light emitting diode (4) and the chassis (5) is provided by a spring element (12) pressing at least a surface of the light emitting diode (4) onto the chassis (5).