Induction Soldering of Ferromagnetic Contacts Without Conductor Overheating
Solution Overview
Problem
Existing methods for soldering contact elements with conductor structures on non-metallic disks, such as those used in automotive or building glazing, often result in excessive heating of temperature-sensitive conductor structures, leading to damage or detachment, and are inefficient in energy usage.
Innovation Solution
An induction soldering system utilizing a ferromagnetic contact element and a soldering tool with an induction loop or coil that generates a magnetic field to heat the contact element directly, without additional guidance of field lines, allowing targeted heating of the solder joint while minimizing heating of the surrounding conductor structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If induction soldering is performed using a conventional coil that couples magnetic field into conductor structure and solder, then soldering can be achieved contactlessly, but excessive heating occurs in the temperature-sensitive conductor structure causing damage or detachment
Solution Approach 1:
The patent applies local quality by using a ferromagnetic contact element that concentrates the magnetic field specifically at the solder joint location. The induction coil generates magnetic field lines that are guided by the ferromagnetic material to heat only the immediate soldering area, while surrounding conductor structures remain unaffected. This localized heating approach resolves the contradiction by achieving reliable soldering without excessive heating of temperature-sensitive areas.
Solution Approach 2:
The ferromagnetic contact element serves as an intermediary between the induction coil and the solder joint. It mediates the magnetic field generation process by concentrating and directing field lines to the specific heating location. This intermediary approach allows contactless heating while preventing direct excessive heating of the conductor structure, thus resolving the technical contradiction.
2Manufacturing precision
If conventional induction soldering methods are used with large induction coils, then broader area heating is achieved, but energy consumption increases and precision of soldering is reduced
Solution Approach 1:
The patent implements local quality by designing the induction coil and ferromagnetic contact element combination to concentrate magnetic field energy precisely at the solder joint. This localized approach improves manufacturing precision by heating only the required area, while reducing energy consumption compared to broader area heating methods. The ferromagnetic material acts as a flux concentrator that directs energy efficiently to the target location.
Solution Approach 2:
The patent changes the physical parameters of the heating system by introducing ferromagnetic material with specific magnetic properties. This parameter change enables the system to concentrate magnetic field lines and achieve precise localized heating with lower energy input, resolving the contradiction between heating precision and energy consumption.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach ensures precise heating of the solder joint, reduces energy consumption, and minimizes damage to temperature-sensitive conductor structures, achieving consistent high-quality soldering with reduced risk of conductor detachment.
Implementation Method 1
a soldering tool with at least one induction loop or induction coil suitable for radiating a magnetic field... which can be connected or is connected to the induction loop or induction coil... the switched-on magnetic field of the soldering tool heats the contact element at least in sections
Implementation Method 2
a coil located on the surface of the wafer facing away from the conductor structure couples a high-frequency magnetic field into the conductor structure, the solder, and the contact element. This utilizes the ability of the magnetic field to transfer the energy required to melt the solder contactlessly through the wafer
Data Source
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Figure 2
AI summary
The invention relates to a device (100) for inductively soldering at least one ferromagnetic contact element (14) to at least one conductor structure (3) on a nonmetallic plate (1), comprising: means (11) for fastening a plate (1) during the soldering operation, at least one soldering tool (13) having at least one induction loop (13I) or induction coil suitable for emitting a magnetic field, means for mutually positioning the soldering tool (13) and the contact element (14) in such a way that the switched-on magnetic field of the soldering tool (13) reliably heats the ferromagnetic contact element (14) and thus the solder joint (2), a generator (13G), which is suitable for generating an alternating voltage with a frequency of up to 1500 kHz and which can be connected to the induction loop (13I) or induction coil.