Induction Soldering with Intermediate Plate for Curved Surfaces
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing methods for soldering electronic components, especially on curved or uneven surfaces, face challenges such as thermal overshoot, high energy consumption, and the formation of gas inclusions leading to unsatisfactory soldering connections due to inefficient heat transfer and uneven temperature distribution.
Innovation Solution
A method using an intermediate plate and an inductor to achieve precise temperature control with eddy currents, shielding electronic components from direct magnetic heating, and operating in a vacuum to prevent gas inclusions, allowing for uniform heat transfer and reduced energy consumption.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If hotplates are used for heating soldering partners and solder, then heating can be achieved through contact heat and convection, but thermal overshoot may occur causing destruction of components and high energy consumption is required
Solution Approach 1:
The patent replaces the mechanical contact-based hotplate heating system with an electromagnetic induction heating system. The induction heating device generates an alternating magnetic field that induces eddy currents in the soldering partners, heating them through electromagnetic induction rather than direct thermal contact. This substitution eliminates the thermal overshoot problem inherent in contact heating while improving temperature control precision and component safety.
Solution Approach 2:
The patent introduces an intermediate plate positioned between the induction heating device and the soldering partners. This intermediate plate serves as a mediator that distributes the electromagnetic energy uniformly across the soldering partners, preventing localized thermal overshoot and ensuring uniform temperature distribution. The intermediate plate also shields the soldering partners from direct exposure to the alternating magnetic field.
2Temperature
If gas convection is used for heating curved baseplates, then heat transfer can be improved, but gas inclusions form in the solder creating voids and spraying
Solution Approach 1:
The patent replaces gas convection heating with electromagnetic induction heating. The induction heating device generates an alternating magnetic field that directly heats the soldering partners and solder through induced eddy currents, eliminating the need for gas convection. This substitution prevents gas inclusions from forming in the solder while maintaining efficient heat transfer, especially for curved baseplates where gas convection is problematic.
Solution Approach 2:
The patent creates a vacuum environment during the soldering process to eliminate gas inclusions. By removing the gas atmosphere, the solder melts and flows without trapping gas bubbles, preventing void formation and spraying. The vacuum environment also eliminates oxidation and other gas-related harmful effects while the induction heating provides the necessary thermal energy for soldering.
3Object-generated harmful factors
If vacuum is used to prevent gas inclusions, then gas inclusions are avoided, but heat transfer becomes inefficient requiring very long heating times
Solution Approach 1:
The patent replaces conventional thermal conduction and convection heating with electromagnetic induction heating. The induction heating device generates an alternating magnetic field that induces eddy currents directly in the soldering partners and solder, heating them rapidly and efficiently in a vacuum environment. This substitution eliminates the slow heating times associated with vacuum soldering using conventional heating methods while maintaining the benefits of gas inclusion prevention.
Solution Approach 2:
The patent utilizes the phase transition of the solder from solid to liquid state through induction heating. The alternating magnetic field induces eddy currents that rapidly heat the solder to its melting point, causing phase transition. This rapid heating in vacuum prevents gas inclusions while significantly reducing heating time compared to conventional vacuum heating methods.
4Ease of manufacture
If curved baseplates are soldered with poor direct thermal contact, then soldering can be performed, but nonuniform temperature distribution results causing inhomogeneous connections
Solution Approach 1:
The patent replaces contact-based thermal heating with electromagnetic induction heating. The induction heating device generates an alternating magnetic field that penetrates the curved baseplate and induces eddy currents throughout the material, heating it uniformly regardless of surface curvature or contact quality. This substitution eliminates the nonuniform temperature distribution problem inherent in contact heating of curved surfaces while maintaining soldering capability.
Solution Approach 2:
The patent introduces an intermediate plate that couples the induction heating device to the curved baseplate. This intermediate plate serves as a mediator that distributes the electromagnetic energy uniformly across the curved surface, ensuring homogeneous temperature distribution even when direct thermal contact is poor. The intermediate plate also provides a stable interface for the induction heating process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables precise temperature profiles with high temperature gradients, reduces the risk of overheating, and prevents gas inclusions, resulting in stable and uniform soldering connections with lower energy consumption.
Implementation Method 1
The inductor (50) generates eddy currents in the intermediate plate (51), such that the intermediate plate (51) is heated
Implementation Method 2
The solder is melted by using energy emitted by the inductor
Implementation Method 3
the intermediate plate (51) is arranged between the inductor (50), on the one hand, and the solder (4a) and the envisaged joining location (5a), on the other hand, in such a way that the electronic component (10) is shielded by the intermediate plate (51) from the inductor (50)
Implementation Method 4
The soldering partners and the solder are connected to one another in an evacuatable chamber at least during the melting of the solder
Data Source
AI summary
A method for producing an electronic device is disclosed. One embodiment provides two soldering partners to be connected to one another at an envisaged joining location and at least one of which includes an electronic component or is formed as such a component, a soldering apparatus having an inductor, and an intermediate plate The soldering partners, the inductor and the intermediate plate are positioned in such a way that the intermediate plate is arranged between the electronic component and the envisaged joining location, on the one hand, and the inductor. The soldering partners are connected at the envisaged joining location by using a solder that is melted by energy emitted by the inductor.