Induction Soldering Vehicle Window Hardware Bonding
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Solution Overview
Problem
Existing methods for bonding hardware to glass substrates, such as vehicle windows, face challenges in achieving a strong and uniform bond, particularly due to variations in substrate curvature and the need for precise positioning and heating.
Innovation Solution
An assembly fixture with induction coil assemblies and movable assembly aids is used to position and heat the glass substrate, allowing for precise placement of hardware with solder, which is then bonded to the inner surface using electromagnetic fields and controlled pressure, ensuring effective bonding and reduced wear on components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by moving object
If induction coil assemblies are positioned in intimate contact with the glass substrate for heating, then heating efficiency is improved, but the induction coils may cause abrasion or damage to the glass surface
Solution Approach 1:
A susceptor layer is applied to the glass substrate to act as an intermediary between the induction coil and the glass. The susceptor absorbs electromagnetic energy and converts it to heat, which is then transferred to the glass and solder, eliminating direct contact between the induction coil and glass surface while maintaining heating efficiency
Solution Approach 2:
The patent replaces direct mechanical contact-based heating with electromagnetic field-based induction heating through the susceptor, eliminating the need for physical contact between the heating element and glass surface
2Manufacturing precision
If the glass substrate is held firmly against the fixture for precise positioning, then positioning accuracy is improved, but the fixture components experience increased wear
Solution Approach 1:
The patent replaces mechanical clamping and positioning systems with a gaseous cushion system that uses controlled gas pressure to hold the glass substrate in position. This eliminates mechanical contact and wear while maintaining precise positioning through gas pressure control
Solution Approach 2:
A gaseous cushion system is introduced between the fixture and glass substrate to provide contactless positioning and holding. Gas is introduced through channels in the fixture to create a stable cushion that maintains precise positioning without mechanical wear
3Use of energy by moving object
If the induction coil assembly is positioned close to the glass substrate for efficient heating, then energy efficiency is improved, but the coil assembly becomes contaminated with solder
Solution Approach 1:
The susceptor layer serves as a mediator that absorbs electromagnetic energy and transfers heat to the glass and solder, allowing the induction coil to be positioned close to the glass for efficient heating while the susceptor prevents solder from contaminating the coil
Solution Approach 2:
The patent uses electromagnetic field coupling through the susceptor instead of direct thermal contact, allowing energy transfer without physical contact between the coil assembly and solder material
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method significantly increases the bonded area between hardware and the glass substrate, improving the 'wetting out' of solder and reducing wear on components, while maintaining a clean induction coil assembly by positioning it opposite the assembly aids, resulting in a robust and efficient bonding process.
Implementation Method 1
the one or more induction coil assemblies are energized to selectively direct one or more electromagnetic fields into the one or more predetermined areas of the vehicle window whereon the electrically conductive material has been disposed, causing heating thereof
Implementation Method 2
The one or more heated areas of the major inner surface of the vehicle window and/or the item of hardware to be bonded will be heated to a temperature sufficient to melt the solder disposed on the one or more items of hardware
Implementation Method 3
The system uses alternating magnetic fields that induce eddy currents and generate heat within susceptors
Implementation Method 4
induce eddy currents and generate heat within susceptors
Data Source
AI summary
Induction soldering via an assembly fixture is utilized to bond one or more items of hardware to a vehicle window to form a vehicle window assembly. A method of operating the assembly fixture to bond the one or more items of hardware to a vehicle window by induction soldering is also an aspect of the invention.