Inductive Chip-to-Chip Coil Sensing for Position and Vibration Detection
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Solution Overview
Problem
Existing information processing apparatuses lack a sensing function despite being capable of flexible wireless communication through inductive coupling between coils, necessitating the addition of a separate sensing device for state quantity detection.
Innovation Solution
An information processing apparatus is designed with chips that include transmission and receiving coils for inductive coupling, enabling detection of changes in relative position, vibration, pressure, temperature, or electromagnetic waves by monitoring voltage or current changes in the receiving coil.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a separate sensing device is added to the information processing apparatus to enable state quantity detection, then the sensing function is improved, but the device complexity increases
Solution Approach 1:
The patent combines the sensing function with the information processing apparatus by integrating a sensing unit into the chip structure. The sensing unit shares the same coil as the wireless communication function, allowing the chip to simultaneously perform both wireless communication and sensing operations without requiring separate independent devices, thus resolving the contradiction between adding sensing capability and increasing device complexity.
Solution Approach 2:
The coil in the chip is designed to serve dual purposes: it functions as both a wireless communication coil and a sensing coil. By making the coil multi-functional, the patent enables the information processing apparatus to perform both data transmission and state quantity detection using the same hardware component, thereby improving adaptability without proportionally increasing device complexity.
2Adaptability or versatility
If additional sensing devices are connected to the information processing apparatus, then the sensing capability is improved, but the ease of operation deteriorates
Solution Approach 1:
The sensing unit is integrated into the chip itself rather than being a separate external device. This integration allows the sensing function to be automatically activated and operated alongside the wireless communication function, eliminating the need for separate connection and configuration steps, thus maintaining ease of operation while improving sensing capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus integrates sensing and processing functions, allowing for the detection of state quantities without additional devices, enhancing flexibility and functionality.
Implementation Method 1
the first chip and the second chips are positioned in close proximity to each other that enables wireless communication through inductive coupling
Implementation Method 2
a second receiving coil capable of receiving the transmission signal by being inductively coupled with the first transmitting coil and a second detection portion configured to detect a voltage or current applied to the second receiving coil
Data Source
AI summary
An apparatus includes first and second chips. The first chip includes a first transmission control portion to generate a transmission signal, and a first transmitting coil connected to the first transmission control portion to transmit the transmission signal. The second chip includes a second receiving coil capable of receiving the transmission signal by being inductively coupled with the first transmitting coil, and a second detection portion to detect a voltage or current applied to the second receiving coil. The first and second chips are in close proximity to enable wireless communication through inductive coupling. The second detection portion is configured to detect, when a change in voltage or current occurring in the second receiving coil satisfies a predetermined condition, a change in relative position between the first chip and the second chip, or vibration applied to the first and second chips, pressure change, temperature change, or electromagnetic wave.