Inductive Component Package Structure with Conductive Through Holes
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Solution Overview
Problem
Integrated circuits (ICs) face challenges when combined with inductive components due to magnetic field-induced current issues, leading to increased layout area and separate manufacturing, packaging, and testing processes, which hinder miniaturization and efficient modulation.
Innovation Solution
The integration of a magnetic body with conductive through holes and conductive patterns forming inductive paths, allowing for the placement of electronic devices within the inductive component, which minimizes induced current effects and enables internal electrical connections, reducing the need for external connections and facilitating modular manufacturing and testing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If inductive components are electrically connected externally to ICs, then magnetic field interference is avoided, but the total layout area increases
Solution Approach 1:
The patent merges the inductive component and IC into a single integrated structure where the inductor is formed using conductive patterns on the IC substrate itself. This integration eliminates the need for separate external connections while maintaining electromagnetic compatibility through careful design of the conductive paths and their spatial arrangement.
Solution Approach 2:
The invention transitions from a planar external connection layout to a three-dimensional integrated structure by forming conductive patterns that extend through multiple layers of the IC substrate, utilizing vertical stacking and layered configurations to reduce the footprint area while maintaining functional separation.
2Ease of manufacture
If inductive components are manufactured separately from ICs, then manufacturing processes are simplified, but modulation advantages are lost
Solution Approach 1:
The patent combines the manufacturing processes for ICs and inductive components into a single integrated fabrication workflow. The inductor structures are formed using the same semiconductor manufacturing steps as the IC, including photolithography, etching, and metallization, allowing both components to be produced simultaneously on the same substrate with full modulation capability.
3Area of stationary object
If inductive components are placed close to ICs, then layout area is reduced, but magnetic field induces current in IC circuitry
Solution Approach 1:
The patent applies different material properties and structural characteristics to different regions of the IC substrate. The inductor regions use specific conductive pattern geometries and material compositions that are optimized for magnetic field containment, while IC circuit regions use different configurations that are optimized for electrical performance, allowing close proximity without interference.
Solution Approach 2:
The invention converts the potentially harmful magnetic field effects into beneficial features by designing the conductive patterns to utilize magnetic flux for enhanced inductance performance. The magnetic fields generated by the inductor are channeled through specific magnetic shield structures and conductive path configurations that actually improve the overall system performance rather than degrading it.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution reduces the total layout area and allows for efficient modulation by containing induced current effects at the magnetic body's edges, enabling the integration of inductive components with ICs without external electrical connections, thus enhancing system miniaturization and manufacturing efficiency.
Implementation Method 1
a plurality of conductive through holes are formed from the top surface to the bottom surface of the magnetic body, and the plurality of conductive through holes are electrically connected via first conductive patterns disposed over the top surface of the magnetic body and second conductive patterns disposed over the bottom surface of the magnetic body so as to form at least one conductive path
Implementation Method 2
containing induced current effects at the magnetic body's edges
Data Source
AI summary
An inductive component and package structure is provided, comprising a magnetic body having a top surface and a bottom surface, wherein a plurality of conductive through holes are formed from the top surface to the bottom surface of the magnetic body, and the plurality of conductive through holes are electrically connected via first conductive patterns disposed over the top surface of the magnetic body and second conductive patterns disposed over the bottom surface of the magnetic body so as to form at least one conductive path, each passing through a corresponding set of conductive through holes, wherein each of the at least one conductive path has two terminals and a corresponding inductance. At least one portion of a first electronic device is disposed in a first space, at least partially surrounded by the at least one conductive path.