Integrated Inductive Connection Pad for IC Substrate Area Reduction

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Solution Overview

Problem

Conventional integrated circuits face challenges in reducing size and cost due to the need for dedicated areas for inductive elements, which occupy substantial space and are not flexibly integrated with connection pads, leading to inefficiencies in wireless communication and increased size and cost.

Innovation Solution

The integration of inductive elements within the structure of a normal connection pad, allowing them to be electrically coupled with circuit elements and external systems, while also serving as a connection terminal, using a conductive and magnetic structure that prevents eddy currents and mechanical stress, enabling flexible design and reduced substrate area usage.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If dedicated areas for inductive elements are used in conventional integrated circuits, then wireless communication functionality is achieved, but substrate area is substantially occupied and design flexibility is reduced

Engineering Contradiction:

Improvedesign flexibilityVSAvoidsubstrate area

Core Design Contradiction:

Adaptability or versatilityVSArea of stationary object

Solution Approach 1:

The patent merges the connection pad and inductive element into a single integrated structure. The inductive element is positioned directly over the connection pad, allowing the same physical space to serve both as an electrical connection terminal and as a functional inductor for wireless communication, thereby eliminating the need for separate dedicated areas.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The connection pad structure is designed to perform multiple functions simultaneously: it serves as an electrical connection terminal for circuit elements and as an inductive element for wireless communication. This multi-functionality allows the substrate area to be used more efficiently without sacrificing either connection capability or wireless functionality.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Area of stationary object

If inductive elements are integrated within connection pad structure, then substrate area is reduced and design flexibility is improved, but electrical coupling and mechanical stress resistance must be maintained

Engineering Contradiction:

Improvesubstrate areaVSAvoidelectrical connection reliability

Core Design Contradiction:

Area of stationary objectVSReliability

Solution Approach 1:

The integrated structure is segmented into distinct functional zones: the connection pad portion for electrical coupling and the inductive element portion for wireless communication. This segmentation allows each part to be optimized for its specific function while maintaining overall structural integrity and electrical reliability.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Different regions of the integrated structure have different properties optimized for their specific functions. The connection pad area is designed with high electrical conductivity for reliable coupling, while the inductive element area is configured with appropriate geometry and material properties for generating magnetic fields, ensuring both electrical reliability and wireless functionality.

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach allows for smaller, cost-effective integrated circuits with integrated inductive elements that can be used for both testing and operational wireless communication, reducing the overall size and increasing the efficiency of substrate use.

Implementation Method 1

an inductive element (112) under said upper metallization layer where said inductive element can be electrically coupled to said connection terminal and to circuit elements outside the connection structure

Methodology Applied

Scientific EffectElectromagnetic induction: Electromagnetic Induction

Implementation Method 2

using a conductive and magnetic structure that prevents eddy currents and mechanical stress

Methodology Applied

Scientific EffectEddy currents: Eddy Currents

Data Source

PatentUS10991654B2Inductive connection structure for use in an integrated circuit

Publication Date: 2021.04.27 STMICROELECTRONICS SRL

AI summary

A pad forms a connection terminal suitable for coupling circuit elements integrated in a chip to circuits outside the chip itself. At least one inductor is provided for use in the reception/transmission of electromagnetic waves or for supplying the chip with power or both. The connection pad and inductor are combined in a structure which reduces overall occupied area. A magnetic containment structure surrounds the structure to contain a magnetic field of the inductor.