Inductively Coupled ICs with Magnetic Communication Paths

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Solution Overview

Problem

As ICs become smaller and more densely packed, existing communication methods between ICs face challenges in efficiently transmitting signals and data without direct electrical connections, leading to increased power consumption and complexity in packaging.

Innovation Solution

The use of inductively coupled integrated circuits with magnetic communication paths, where coils generate electrical signals based on magnetic flux to facilitate signal transfer between ICs, reducing the need for direct connections and power consumption.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If direct electrical connections are used between ICs, then signal transmission is reliable, but device complexity and packaging difficulty increase as ICs become smaller and more densely packed

Engineering Contradiction:

Improvesignal transmission reliabilityVSAvoidpackaging complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent replaces direct electrical connections (mechanical/electrical contact system) with inductive coupling through magnetic fields. Coils on each IC generate and detect magnetic flux to transmit signals wirelessly between ICs, eliminating the need for physical electrical connections and reducing packaging complexity while maintaining communication reliability

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent introduces magnetic flux as an intermediary medium between ICs. Instead of direct electrical contact, signals are transmitted through magnetic field coupling between coils on different ICs, allowing communication without direct electrical connections and simplifying the packaging structure

Inventive Principle:

Principle #24Intermediary (Mediator)

2Volume of moving object

If more ICs are packed in smaller space, then device size is reduced, but the number of direct electrical connections required increases

Engineering Contradiction:

Improvedevice sizeVSAvoidnumber of connections

Core Design Contradiction:

Volume of moving objectVSDevice complexity

Solution Approach 1:

The patent replaces the mechanical connection system with inductive coupling, allowing each IC to communicate with multiple neighbors through magnetic field coupling rather than requiring dedicated physical connections for each IC pair, thereby reducing the total number of connections needed as IC density increases

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The inductive coupling interface provides universal communication capability between ICs, where a single coil interface can communicate with multiple other ICs through magnetic field coupling, rather than requiring dedicated point-to-point connections for each IC pair, thus reducing connection complexity in dense packaging

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Use of energy by moving object

If direct electrical connections are used between ICs, then power consumption is higher, but inductive coupling requires additional magnetic path structures

Engineering Contradiction:

Improvepower consumptionVSAvoidmagnetic path structure

Core Design Contradiction:

Use of energy by moving objectVSDevice complexity

Solution Approach 1:

The patent merges the magnetic communication path with the IC substrate or packaging structure itself. The magnetic path is integrated into the existing structure rather than being added as a separate component, thus providing the necessary magnetic coupling infrastructure without significantly increasing device complexity

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The inductive coupling system uses the inherent magnetic properties of the IC substrate and surrounding structures to provide the magnetic path, rather than requiring external power-intensive connection systems. The magnetic flux naturally follows the path of least resistance through the substrate and magnetic materials already present in the structure

Inventive Principle:

Principle #25Self-service

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method enables efficient bidirectional communication between ICs with reduced power consumption and simplified packaging, supporting advancements in IC fabrication while minimizing the need for direct electrical connections.

Implementation Method 1

one or more coils or other inductive elements that are used to couple integrated circuit dies within the integrated circuit package and/or to couple the inductively coupled IC to other inductively coupled ICs that are positioned in proximal location to each other

Methodology Applied

Scientific EffectElectromagnetic induction: Electromagnetic Induction

Data Source

PatentUS8217492B2Inductively coupled integrated circuit with magnetic communication path and methods for use therewith

Publication Date: 2012.07.10 NXP USA INC

AI summary

An integrated circuit includes a first integrated circuit die having a first circuit and a first inductive interface and a second integrated circuit die having a second circuit and a second inductive interface. A substrate is coupled to support the first integrated circuit die and the second integrated circuit die, the substrate including a magnetic communication path aligned with the first inductive interface and the second inductive interface, to magnetically communicate signals between the first circuit and the second circuit.