Inductive Coupling Semiconductor Device for High-Frequency Signal Transmission
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Solution Overview
Problem
Photocouplers face challenges in miniaturization and frequency followability due to their structure, which includes a light emitting device and a photodetector, making them less reliable for high-frequency signal transmission.
Innovation Solution
A semiconductor device with two semiconductor chips integrated into a single package, using inductive coupling between coils on each chip to transmit signals without contact, with a specific configuration of wire groups and inter-wire distances to secure withstand voltage and prevent electric short circuits.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If photocoupler structure with light emitting device and photodetector is used, then signal transmission between circuits with different potentials is achieved, but device size increases and frequency followability deteriorates
Solution Approach 1:
The patent replaces the optical coupling mechanism (light emitting device and photodetector) with an electromagnetic coupling mechanism using two inductors. This substitution eliminates the need for light conversion components, thereby reducing device complexity while maintaining signal transmission reliability between circuits with different potentials.
Solution Approach 2:
The patent changes the fundamental transmission mechanism from optical to electromagnetic coupling. By using inductive coupling between two inductors, the system achieves signal transmission through magnetic field interaction, which improves frequency followability and reduces device size compared to photocoupler structures.
2Reliability
If inductive coupling of two inductors is used, then miniaturization and frequency followability are improved, but withstand voltage between wires may be insufficient causing electric short circuit
Solution Approach 1:
The patent applies different wire grouping strategies for different functional purposes. Signal wires are grouped together to minimize interference, while power supply wires are separated from signal wires by a predetermined distance to ensure adequate withstand voltage. This local differentiation of wire arrangement quality prevents electric short circuits while maintaining compact design.
Solution Approach 2:
The patent groups wires carrying the same potential together in wire groups, and separates wire groups with different potentials by adequate distances. This equipotential arrangement minimizes potential differences between adjacent wires, reducing the risk of electric short circuits while enabling compact inductive coupling design.
3Ease of manufacture
If multiple wire groups are used for signal and power supply, then electrical coupling is achieved, but inter-wire distance must be increased to secure withstand voltage
Solution Approach 1:
The patent optimizes wire arrangement by creating compact wire groups for signal transmission while maintaining adequate separation from power supply wires. Within each wire group, wires are closely spaced for efficient coupling, while the distance between different wire groups (signal vs. power) is controlled to meet withstand voltage requirements. This local quality differentiation enables compact package design.
Solution Approach 2:
The patent arranges wires carrying the same potential in close proximity within wire groups, while separating wire groups with different potentials by predetermined distances. This equipotential grouping maximizes wire coupling efficiency for signal transmission while minimizing the area required for withstand voltage clearance between power and signal wires.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution improves the reliability and miniaturization of the semiconductor device, enabling efficient high-frequency signal transmission while maintaining high withstand voltage, thus addressing the limitations of photocouplers.
Implementation Method 1
a technology of transmitting an electric signal by performing inductive coupling of two inductors has been developed
Data Source
AI summary
In an SOP1 having a semiconductor chip and another semiconductor chip, in wire coupling between the chips, a withstand voltage can be secured by setting an inter-wire distance between a wire in a first wire group that is closest to a second wire group and a wire in the second wire group that is closest to the first wire group to be larger than an inter-wire distance between any wires in the first wire group and the second wire group, which makes it possible to attain improvement of reliability of the SOP1.