Inductive Heating Coil Thermal Coupling via Conductive Adhesive
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Solution Overview
Problem
Conventional induction heating cookers face issues with inconsistent cooling due to size variations in ferrites, leading to thermal coupling problems, increased size, and degradation of electrical insulation, which affects cooking performance and efficiency.
Innovation Solution
The design includes a coil unit with ferrites housed in a coil base, a heat dissipation plate, and an electrical insulation member, allowing surface contact for efficient heat transfer and reduced size, while maintaining electrical insulation through the use of an adhesive agent with both heat conduction and insulation properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If ferrites are used as intermediate members for heat conduction, then heat transmission from induction heating coil to heat dissipation plate is enabled, but size variations in ferrites cause inconsistent thermal coupling and degraded cooling ability
Solution Approach 1:
The patent introduces a heat conductive adhesive as an intermediary substance between the induction heating coil and ferrites, and between ferrites and heat dissipation plate. This adhesive mediator compensates for size variations in ferrites by filling gaps and ensuring consistent thermal coupling, thereby maintaining reliable heat transmission while accommodating manufacturing tolerances of the ferrite components.
Solution Approach 2:
The patent employs a composite thermal management system combining ferrites, heat conductive adhesive, and heat dissipation plate. The heat conductive adhesive acts as a composite material that bridges the thermal interface, combining the high magnetic permeability of ferrites with the thermal conduction properties of the adhesive to achieve consistent cooling performance despite ferrite size variations.
2Temperature
If cooling air is passed through holes in heat dissipation plate, then cooling effect is achieved, but the structure becomes complex and size increases
Solution Approach 1:
The patent extracts the cooling function from the heat dissipation plate by separating the heat dissipation function (performed by the plate) from the active cooling function (performed by blowing cooling air). This allows the heat dissipation plate to maintain a simple flat structure without holes or complex internal channels, while the cooling air is supplied from an external source to achieve the cooling effect.
3Loss of energy
If induction heating coil is directly placed on ferrites, then thermal coupling is achieved, but electrical insulation deteriorates due to induced electric potentials
Solution Approach 1:
The patent introduces a heat conductive adhesive as an intermediary layer between the induction heating coil and ferrites. This adhesive layer maintains thermal coupling by filling gaps and ensuring heat transmission, while simultaneously providing electrical insulation to prevent degradation caused by induced electric potentials between the coil and ferrites.
Solution Approach 2:
The patent uses a composite approach by combining the heat conductive adhesive with the ferrite and coil assembly. The adhesive material possesses both thermal conduction properties to maintain heat transmission and electrical insulation properties to protect against electrical breakdown, creating a multi-functional interface layer.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances cooling efficiency, reduces the overall size of the induction heating device, and stabilizes cooking performance by ensuring consistent thermal coupling and improved electrical insulation.
Implementation Method 1
a coil unit (1A, 1B, 1C) including a heating coil (4) for heating a to-be-heated object (2)
Implementation Method 2
heat from the heating coil (4) is transmitted to the heat dissipation plate (12A, 12B, 12C) and, thus, the heating coil (4) is cooled
Data Source
Figure 1
Figure 2~3
Figure 4
AI summary
An inductive heating device is structured such that a coil base (5) and ferrites (6) placed under a heating coil (4) in the vertical direction are flushed with each other at their lower surfaces and are directly placed on a heat dissipation plate (12A). A heat conductive member (8) is charged between the ferrites (6) and an electrical insulating member (9) sandwiched between the heating coil (4) and the ferrites (6), at least at a portion thereof, so that thickness variations in the ferrites (6) are absorbed thereby, which realizes a state where they are thermally coupled to each other from the heating coil (4) to the heat dissipation plate (12A).