Inductive Heating Circuit Layout for Aerosol Device Thermal Management
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing smoking articles burn tobacco to create smoke, and alternative aerosol generating devices using RLC resonance circuits for inductive heating face inefficiencies in heat management and component durability.
Innovation Solution
An apparatus with an LC resonant circuit and a switching arrangement, including inductive elements and transistors mounted on a substrate, is thermally connected to a heat sink for efficient heat dissipation, using flat no-lead packages and copper heat reservoirs to manage heat and improve durability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If inductive elements and transistors are mounted on a substrate without thermal management, then the device structure is simpler, but heat accumulation reduces component durability and reliability
Solution Approach 1:
The heat sink is integrated directly with the substrate, merging the thermal management function into the existing structural component. This eliminates the need for separate heat dissipation structures while effectively managing heat from inductive elements and transistors, thereby improving component durability without significantly increasing device complexity.
Solution Approach 2:
The substrate serves as an intermediary thermal pathway between the heat-generating components (inductive elements and transistors) and the heat sink. By conducting heat through the substrate to the heat sink, the system achieves effective thermal management while maintaining a compact and relatively simple device structure.
2Loss of energy
If heat is not efficiently dissipated from inductive elements and transistors, then the device structure is simpler, but heat management efficiency deteriorates
Solution Approach 1:
The heat sink is merged with the substrate structure, creating an integrated thermal management system. This design achieves efficient heat dissipation from inductive elements and transistors by utilizing the substrate as a thermal conduction pathway, thereby improving energy efficiency without adding significant structural complexity.
Solution Approach 2:
The substrate performs multiple functions: it provides mechanical support for mounting components and simultaneously serves as a thermal conduction pathway to the heat sink. This multi-functionality improves heat management efficiency while avoiding the need for additional dedicated thermal management structures.
3Volume of moving object
If inductive elements are mounted on the substrate, then the device structure is more compact, but heat accumulation increases
Solution Approach 1:
The substrate acts as an intermediary thermal pathway that conducts heat away from the inductive elements to the heat sink. This enables compact mounting of inductive elements on the substrate while effectively managing the heat they generate, thereby maintaining a compact device volume without excessive temperature rise.
Solution Approach 2:
Heat is extracted from the inductive elements through the substrate and transferred to the heat sink. This extraction of heat allows the inductive elements to be mounted in a compact arrangement on the substrate without suffering from excessive heat accumulation, thus achieving both compactness and effective thermal management.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus achieves efficient inductive heating with improved heat management and component longevity, enhancing the performance of non-combustible aerosol generating devices.
Implementation Method 1
one or more inductive elements for inductively heating a susceptor arrangement to heat an aerosol generating material to thereby generate an aerosol
Implementation Method 2
inductive elements for inductively heating a susceptor arrangement
Implementation Method 3
the inductive elements of the resonant circuit and the transistors of the switching arrangement are thermally connected to the heat sink
Data Source
Figure 1~2
Figure 3
Figure 4
AI summary
An apparatus for a non-combustible aerosol generating device is described comprising: a resonant circuit (51) comprising one or more inductive elements (43) for inductively heating a susceptor arrangement (16) to heat an aerosol generating material to thereby generate an aerosol, wherein the inductive elements are mounted on a first external surface (54) of a substrate (53); a switching arrangement (52) for enabling an alternating current to be generated from a voltage supply (11) and flow through one or more of said inductive elements to cause inductive heating of the susceptor arrangement, wherein the switching arrangement comprises a plurality of transistors mounted to a second external surface (55) of the substrate; and a heat sink (61), wherein the inductive elements of the resonant circuit and the transistors of the switching arrangement are thermally connected to the heat sink via connections (62, 63).