Inductive Position Sensor Secondary Windings
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Solution Overview
Problem
Inductive position sensors face challenges in compact design due to the need for a large number of turns in secondary windings, which increases the space occupied on printed circuit boards and requires a high number of vias for connection, making them difficult to implement and costly.
Innovation Solution
The design features secondary windings with turns produced on two layers of a printed circuit board, where each turn has a concave shape on one layer and a complementary shape on the other, connected by vias, allowing for a compact arrangement with reduced via usage and constant distance from the primary winding, facilitating easy implementation and measurement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a large number of turns are used in secondary windings to obtain measurable induced currents, then measurement reliability is improved, but the area occupied on the printed circuit board increases
Solution Approach 1:
The patent transitions from a single-layer PCB layout to a multi-layer PCB configuration, placing secondary windings on multiple layers and connecting them through vias. This dimensional change allows the windings to be stacked vertically, significantly reducing the horizontal area occupied on the PCB while maintaining the required number of turns for reliable measurement.
2Area of stationary object
If turns are produced on two separate layers to limit space, then the area occupied on the printed circuit board is reduced, but the number of vias required increases
Solution Approach 1:
The patent combines multiple secondary windings onto a single integrated structure by placing them on different PCB layers and interconnecting them through vias. This merging approach consolidates what would otherwise be separate components into one unified assembly, reducing overall complexity despite the introduction of via connections.
3Reliability
If a large number of turns are used, then induced current measurement reliability is improved, but the overall dimensions of the sensor increase
Solution Approach 1:
The patent utilizes the vertical dimension by stacking secondary windings on multiple PCB layers, allowing a large number of turns to be packed into a compact footprint. This vertical arrangement maintains the sensor's overall dimensions small while accommodating the necessary number of turns for reliable induced current measurement.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This arrangement allows for a compact, easy-to-implement inductive position sensor with reduced via count, maintaining high accuracy and efficiency in position measurement while minimizing the overall dimensions and production costs.
Implementation Method 1
The operating principle of an inductive sensor is based on the variation of coupling between a primary winding and secondary windings of a transformer operating at high frequency
Implementation Method 2
Currents induced in the target in fact modify the currents induced in the secondary windings
Data Source
AI summary
This inductive position sensor includes: a primary winding, and at least two secondary windings (4, 6) each constituted by several turns (8) produced on two layers of a printed circuit board. A secondary winding has turns (8) each having substantially the same shape, aligned in a direction referred to as longitudinal, each time with an offset between them. The turns (8) each have a first globally concave part (12) disposed on one layer of the printed circuit board and a second globally concave part (14) disposed on the other layer of the printed circuit board, the first part of a turn is connected to the second part of the same turn by a first via (36a) passing through the printed circuit board, the first part of a turn is connected to the second part of an adjacent turn by a second via (36b) passing through the printed circuit board.