Inductive Probe for 3D Interconnect Testing
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Solution Overview
Problem
Conventional semiconductor die testing methods often misclassify die as defective due to cosmetic damage or inaccuracies, leading to wasteful processes where good die are discarded and defects are only discovered after costly packaging, resulting in inefficient and inaccurate testing.
Innovation Solution
A 'no touch' testing probe apparatus that electrically tests semiconductor die using a touchless method by generating an electromagnetic field around 3D interconnect structures, allowing for real-time determination of known good die without physical contact, thereby avoiding damage and misclassification.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If conventional probe needle testing is used to electrically test semiconductor die, then electrical characteristics can be measured, but the die are damaged particularly on bond pads and under bump metallization
Solution Approach 1:
The patent replaces the mechanical contact system (probe needles physically touching die) with an inductive coupling system using coils positioned above and below the die. Electrical testing is achieved through electromagnetic induction without mechanical contact, eliminating damage to bond pads and under bump metallization while maintaining electrical measurement capability
Solution Approach 2:
The patent introduces magnetic fields as an intermediary between the testing apparatus and the die. Coils generate magnetic fields that couple inductively with the die, allowing electrical testing to occur through the magnetic field medium rather than direct physical contact, thus preventing mechanical damage
2Measurement precision
If optical testing is used to inspect die, then cosmetic defects can be detected, but die with only minor cosmetic damage are marked for removal
Solution Approach 1:
The patent changes the testing parameter from optical/cosmetic inspection to inductive/electrical property measurement. By measuring electrical characteristics through inductive coupling rather than visual inspection, the system can distinguish between cosmetic defects that do not affect functionality and actual electrical failures, preventing unnecessary discarding of good die
Solution Approach 2:
The patent replaces the optical testing system with an inductive testing system that measures electrical properties directly. This substitution allows for more accurate assessment of die functionality by measuring actual electrical characteristics rather than relying on cosmetic appearance, reducing false positives in defect detection
3Productivity
If wafer probe testing is used, then die can be tested for characteristics, but testing limitations and inaccuracies result in misclassification of good and bad die
Solution Approach 1:
The patent replaces the mechanical probe needle system with an inductive coupling system using coils. This substitution eliminates the physical contact limitations and inaccuracies of conventional probing, providing more reliable electrical measurements without reducing testing throughput, as the inductive system can test multiple die simultaneously
Solution Approach 2:
The inductive testing system provides multi-functionality by capable of testing electrical characteristics without physical contact, potentially simultaneously testing multiple die, and providing both presence and functionality assessment in a single testing operation, thereby improving both accuracy and productivity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces die overkill, increases accuracy, and saves costs by avoiding physical contact and misclassification, providing a more efficient and effective testing process compared to conventional methods.
Implementation Method 1
a first inductor configured to generate an electromagnetic field to inductively cause a voltage within a 3DI structure of the die
Implementation Method 2
a second inductor configured to detect the voltage within the 3DI structure
Data Source
AI summary
A testing probe apparatus for testing die. The testing probe may include a probe interface and a carrier for supporting at least one die comprising 3D interconnect (3DI) structures. The probe interface may be positionable on a first side of the at least one die and include a voltage source and at least one first inductor operably coupled to the voltage source. A voltage sensor and at least one second inductor coupled to the voltage sensor may be disposed on a second opposing side of the at least one die. The voltage source of the probe interface may be configured to inductively cause a voltage within the 3DI structures of the at least one die via the at least one first inductor. The voltage sensor may be configured to sense a voltage within the at least one 3DI structure via the at least one second inductor. Related systems and methods are also disclosed.