Inductive Signal Transmission Between Semiconductor Chips
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Solution Overview
Problem
Existing semiconductor devices face challenges in transmitting electric signals between circuits with different potentials due to size limitations of photo couplers and difficulties in maintaining insulation when using inductive coupling, especially at high frequencies.
Innovation Solution
A semiconductor device design featuring one or two semiconductor chips with an interconnect layer, an interconnect substrate, and inductors for signal transmission, where solder balls or bumps secure the distance between the chips and substrate, ensuring insulation even with differing signal voltages.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If photo couplers are used to transmit electric signals between circuits with different potentials, then signal transmission is achieved, but the device size increases due to light emitting and receiving elements
Solution Approach 1:
The patent replaces the optical system (light emitting diode and photo transistor) with an electromagnetic induction system using inductors. This substitution eliminates the need for light conversion components, thereby reducing device size while maintaining signal transmission capability between circuits with different potentials.
Solution Approach 2:
The patent introduces inductors as intermediary elements that enable magnetic coupling between circuits with different potentials. The inductors act as mediators that transfer signals through magnetic fields without requiring direct electrical contact or large optical components, thus achieving compact signal transmission.
2Area of stationary object
If inductive coupling is used to transmit signals, then device size is reduced, but insulation between circuits with different potentials cannot be secured when distance between inductors becomes short
Solution Approach 1:
The patent moves the inductors from the same plane to different vertical levels (stacked configuration). By utilizing the vertical dimension, the inductors can be positioned close together horizontally for compact size while maintaining adequate vertical separation for insulation, thus resolving the contradiction between miniaturization and electrical isolation.
Solution Approach 2:
The patent divides the coupling structure into separate vertical layers with insulating materials between them. This segmentation allows the inductors to be positioned in different planes, enabling compact horizontal arrangement while maintaining electrical insulation through the intermediate insulating layers.
3Area of stationary object
If inductive coupling is used for signal transmission, then photo coupler size limitations are overcome, but signal following capability deteriorates at high frequencies
Solution Approach 1:
The patent optimizes the physical parameters of the inductors (such as winding configuration, core material, and geometric dimensions) to enhance their frequency response characteristics. By carefully adjusting these parameters, the inductive coupling system achieves both compact size and high-frequency signal following capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design allows for secure insulation and efficient signal transmission between circuits with different potentials, addressing size and frequency limitations of previous technologies.
Implementation Method 1
a first inductor that is formed in the interconnect layer, and is connected to one of the first circuit and the second circuit; a second inductor that is located above the first inductor
Implementation Method 2
the chip-side connecting terminal and the substrate-side connecting terminal are connected through a first solder ball or a first bump
Data Source
AI summary
In a semiconductor device, a first semiconductor chip includes a first circuit and a first inductor, and a second semiconductor chip includes a second circuit and chip-side connecting terminals. An interconnect substrate is placed over the first semiconductor chip and the second semiconductor chip. The interconnect substrate includes a second inductor and substrate-side connecting terminals. The second inductor is located above the first inductor. The chip-side connecting terminals and the two substrate-side connecting terminals are connected through first solder balls.