Inductive Sensor Coil Assembly Without a Separate Bobbin
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing manufacturing processes for inductive sensor devices are complex and costly, requiring additional steps and materials for coil assembly and electrical connections, which can lead to mechanical inflexibility and potential strength issues in the final product.
Innovation Solution
A coil-free coil is inserted into an all-round groove of the shell seed, eliminating the need for a separate coil body and additional assembly steps, with direct soldering to a circuit board using bending stiffener connections and non-conductive materials for mechanical flexibility and avoiding short circuits.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a wire is wound onto a coil former to form a coil, then the coil can be assembled into the sensor device, but the manufacturing process becomes complex and costly with additional material requirements
Solution Approach 1:
The patent extracts and eliminates the coil former from the traditional coil assembly structure. By winding the coil directly onto the shell core without a separate coil former, the manufacturing process is simplified, reducing both material requirements and assembly complexity while maintaining the functional integrity of the coil structure
Solution Approach 2:
The patent merges the coil winding process directly with the shell core structure. Instead of creating a separate coil assembly on a coil former and then attaching it to the shell core, the coil is wound directly onto the shell core, combining multiple components and steps into a single integrated manufacturing process
2Reliability
If rigid connectors are used to connect the coil to the circuit board, then electrical connection is achieved, but mechanical flexibility is reduced and force peaks cannot be mitigated
Solution Approach 1:
The patent employs flexible printed circuit board (FPC) technology to create a flexible electrical connection between the coil and the circuit board. The FPC can bend and deform to absorb mechanical stress and force peaks, maintaining reliable electrical connection while providing the necessary mechanical flexibility that rigid connectors cannot achieve
Solution Approach 2:
The patent changes the mechanical parameters of the connection structure by transitioning from rigid connectors to flexible circuit materials. This parameter change allows the connection to dynamically adapt to mechanical stresses while maintaining electrical conductivity, resolving the contradiction between connection reliability and mechanical flexibility
3Ease of operation
If guide grooves and contact pins are used for electrical connections, then the coil connections can be connected to the circuit board, but additional manufacturing steps and intermediate elements are required
Solution Approach 1:
The patent removes the intermediate elements of guide grooves and contact pins from the electrical connection path. By winding the coil directly onto the shell core with integrated connection points, the design eliminates the need for separate guiding structures and intermediate contact elements, simplifying both the manufacturing process and the overall device structure
Solution Approach 2:
The patent combines the functions of coil support, electrical connection guidance, and circuit board interfacing into a single integrated structure. The shell core serves both as the magnetic core and as the structural element that directly receives and connects the coil windings, eliminating the need for separate guide grooves and contact pin assemblies
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies the manufacturing process, reduces material costs, and enhances mechanical flexibility between the shell nucleus and the circuit board, mitigating strength-related issues in the sensor device.
Implementation Method 1
inductive sensor device
Data Source
Figure 1~2
Figure 3~4
Figure 5~6
AI summary
The invention relates, inter alia, to a method for manufacturing an inductive sensor device, wherein a coil (10) is inserted into a shell core (20) in the method. According to the invention, it is provided that the coil (10) is a self-supporting, coil-body-free coil (10) inserted into a circumferential groove (21) of the shell core (20).