Inductive Sensor Assembly with Hydrophobic Potting Gel

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Solution Overview

Problem

Electronic components, such as those in bathing installations, are vulnerable to corrosion from moisture, and existing encapsulating materials may not adequately protect them in harsh environments.

Innovation Solution

A touch-sensitive sensor assembly with a housing structure made from dielectric plastic, incorporating a flexible metal domed spring structure and a resiliently deformable potting gel that is hydrophobic and resistant to moisture, allowing for flexible actuation while maintaining protection from corrosive environments.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If traditional encapsulating materials are used to protect electronic components from moisture, then corrosion protection is provided, but the components lose flexibility and become rigid

Engineering Contradiction:
Improvecorrosion protectionVSAvoidflexibility
Core Design Contradiction:
ReliabilityVSAdaptability or versatility

Solution Approach 1:

The patent changes the physical parameters of the encapsulating material by using a gel formulation that maintains flexibility while providing protection. The gel's viscoelastic properties allow it to conform to component movements and thermal expansions without cracking, thus maintaining both protection and flexibility simultaneously

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent employs a composite gel material that combines protective properties with flexible characteristics. This composite formulation integrates corrosion-resistant ingredients with flexible polymer matrices, creating a material that delivers both corrosion protection and mechanical flexibility

Inventive Principle:
Principle #40Composite materials

2Reliability

If rigid encapsulating materials are used to seal electronic components, then environmental sealing is achieved, but the sensor assembly cannot accommodate thermal expansion and contraction

Engineering Contradiction:
Improveenvironmental sealingVSAvoidthermal stability
Core Design Contradiction:
ReliabilityVSStability of the object's composition

Solution Approach 1:

The gel material's viscoelastic parameters enable it to accommodate thermal cycling. The material softens at elevated temperatures to absorb expansion stresses and maintains structural integrity at lower temperatures, providing thermal stability while preserving environmental sealing

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The gel material provides beforehand cushioning by absorbing thermal expansion stresses before they can cause damage to the sealed components. The material's compliant nature anticipates and mitigates thermal shock effects, protecting the assembly during temperature transitions

Inventive Principle:
Principle #11Beforehand cushioning (Prior cushioning)

3Reliability

If thick encapsulating material is used to protect components, then corrosion protection is improved, but the device size increases

Engineering Contradiction:
Improvecorrosion protectionVSAvoiddevice size
Core Design Contradiction:
ReliabilityVSVolume of moving object

Solution Approach 1:

The gel material's unique rheological parameters allow it to provide superior corrosion protection at reduced thickness. The material's ability to conform to surface irregularities and self-heal minor defects enables effective sealing with thinner applications compared to traditional rigid encapsulants

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively protects electronic components from moisture-induced corrosion while enabling sensitive touch-based control systems in bathing installations, ensuring reliable operation and user safety.

Implementation Method 1

a resiliently deformable potting gel that is hydrophobic and resistant to moisture

Methodology Applied
Scientific EffectHydrophobe: Hydrophobe

Implementation Method 2

The circuit board includes an inductive sensor area

Methodology Applied
Scientific EffectElectromagnetic induction: Electromagnetic Induction

Data Source

PatentUS8259456B2Environmentally sealed inductive sensor assembly
Publication Date: 2012.09.04 BALBOA WATER GROUP LLC
  • US8259456B2 patent drawing
  • US8259456B2 patent drawing
  • US8259456B2 patent drawing

AI summary

An exemplary embodiment of an inductive electrical sensor assembly includes a hollow housing structure defining an open space within the housing structure and a circuit board mounted in the open space. The circuit board includes an inductive sense area. A flexible metal domed spring structure is mounted over the inductive sensor area. A stem portion extends from a actuator area of the housing structure and having a distal end disposed adjacent to or in contact with the spring structure. The domed spring structure is adapted to be flexed toward the inductive sensor area by force exerted by the stem portion when a user exerts force on the actuator area, the flexing of the domed spring structure resulting in a change of inductance of the inductive sensor area which may be sensed to indicate an actuator push. An exemplary embodiment of the sensor assembly may include a resiliently deformable potting material substantially filling open spaces in the hollow housing structure between the top surface and the circuit board, and an open space below the circuit board, enabling flexure of the domed spring structure while providing environmental protection.