Inductive Sensor Insert Assembly for Rivet-Free PCB Positioning
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Solution Overview
Problem
Existing inductive sensors face high resin consumption costs and production time due to the use of rivets for positioning the printed circuit board, which also introduce design weight and tolerance sensitivity.
Innovation Solution
A method involving positioning a printed circuit board in a housing, using an insert with complementary shapes and beveled bearing surfaces to secure the board in place, followed by resin pouring and polymerization, eliminating the need for rivets.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If rivets are used to position and fasten the printed circuit board, then the board is securely immobilized, but the design becomes more complex, heavier, and more sensitive to tolerance variations
Solution Approach 1:
The patent removes the rivets from the system entirely, extracting the fastening element that caused the complexity and tolerance sensitivity issues. The solution uses only the housing and insert structures to achieve immobilization, eliminating the need for separate fastening components.
Solution Approach 2:
The patent merges the positioning and fastening functions into the integrated housing and insert structure. The insert with its bearing surfaces and the housing with its recesses work together as a unified system to achieve both positioning and secure immobilization without requiring separate rivet fastening operations.
2Reliability
If rivets and heading operations are used to fasten the printed circuit board, then the board is securely fastened, but production time increases and manufacturing complexity increases
Solution Approach 1:
The patent extracts and eliminates the rivet fastening process and heading operations from the manufacturing sequence. By using the insert and housing structure alone, all fastening operations are removed, allowing for simpler, faster assembly without compromising reliability.
Solution Approach 2:
The insert is pre-positioned in the housing recess with its bearing surfaces aligned to automatically press against the printed circuit board when assembled. This preliminary positioning action eliminates the need for subsequent fastening operations like riveting and heading, streamlining the manufacturing process.
3Reliability
If resin is poured to immobilize the printed circuit board, then the board is protected and immobilized, but manufacturing costs increase and production time increases
Solution Approach 1:
The insert is pre-assembled in the housing recess before pouring the resin. This preliminary positioning action creates a structured framework that guides the resin flow and ensures proper immobilization, reducing the required resin volume and accelerating the curing process while maintaining positioning stability.
Solution Approach 2:
The patent applies resin locally around the printed circuit board and insert assembly rather than filling the entire housing volume. The bearing surfaces and insert structure create localized zones that guide resin distribution, reducing overall resin consumption and shortening production time while maintaining necessary positioning stability.
4Productivity
If resin volume is reduced to save cost and time, then manufacturing cost and production time decrease, but positioning reliability may be compromised
Solution Approach 1:
The insert is pre-positioned in the housing recess with its bearing surfaces aligned to press against the printed circuit board before resin pouring. This preliminary action creates a mechanical framework that maintains positioning reliability even with reduced resin volume, as the insert-housing structure provides continuous support and constraint.
Solution Approach 2:
The insert acts as an intermediary element between the housing and the printed circuit board, providing mechanical support and positioning stability. This intermediary structure ensures that positioning reliability is maintained even when resin volume is reduced, as the insert bears the load and maintains alignment independently of the resin quantity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Reduces resin volume by up to 50%, decreases production time, and ensures reliable, tolerance-resistant positioning without the need for rivets.
Implementation Method 1
Pouring a resin into the interior space of said housing lined with the printed circuit board and the insert, Polymerization of said resin
Data Source
AI summary
The invention relates to an inductive sensor (100) and its manufacturing method, said sensor having a housing (110) extending in a plane (x, y) with a thickness measured along an axis (z), a printed circuit board (130) and an insert (120), the printed circuit board and the insert superposed on the circuit board both being embedded in a resin in an interior space of said housing, the interior space being defined by a bottom (119) and an outer edge (116), characterized in that the outer edge of said housing has at least one surface (114) bearing against a surface (124) provided on the periphery of the insert, the printed circuit board thus being pressed against the bottom of said housing.