Inductive Chip-to-Chip Links for Testing Stacked Semiconductors
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Solution Overview
Problem
Conventional semiconductor systems rely on wired communication between master and slave devices, limiting access to individual chips in a stacked semiconductor device, especially after packaging, and making it difficult to electrically access chips during testing due to the use of micro bumps.
Innovation Solution
Implementing wireless communication using inductor pads for data and clock signal transmission between master and slave devices, enabling reliable data recovery and independent access to each chip through inductive coupling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wired communication through pads and wires is used for data transmission between master and slave devices, then reliable data transmission is achieved, but access to individual chips in a stacked semiconductor device is limited and testing becomes difficult
Solution Approach 1:
The patent replaces the mechanical wired connection system (pads, wires, bumps) with a wireless electromagnetic field-based communication system. Inductor pads generate magnetic fields that couple between master and slave devices, eliminating the need for physical wire connections and enabling wireless data transmission while maintaining reliability through magnetic coupling between inductor pads.
Solution Approach 2:
The patent introduces inductor pads as intermediary components that convert electrical signals to magnetic fields for wireless transmission. The inductor pads act as mediators between the electrical circuitry and the wireless communication interface, enabling data transmission through magnetic field coupling without direct wire connections.
2Reliability
If micro bumps are used for electrical connection between stacked chips, then electrical connectivity is achieved, but electrical access during testing becomes difficult
Solution Approach 1:
The patent replaces the mechanical bump-based electrical connection system with a wireless magnetic field coupling system. Instead of relying on physical micro bumps for both connectivity and testing, the system uses inductor pads that generate magnetic fields for data transmission, allowing testing without physical contact with the bump connections.
3Productivity
If stacked chip architecture is used to elevate integration, then degree of integration is improved, but access to individual chips becomes limited after packaging
Solution Approach 1:
The patent segments the communication interface by providing separate inductor pads for data transmission and clock signal transmission. This segmentation allows independent access and testing of different functional blocks within the stacked architecture, enabling individual chip access while maintaining high integration through wireless communication.
Solution Approach 2:
The inductor pads serve as intermediary wireless interfaces that enable external access to individual chips within the stacked architecture. By placing inductor pads on each chip, the system allows selective wireless communication with specific chips without requiring physical disassembly or wire bonding, thus maintaining integration while enabling access.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables secure and reliable wireless communication between master and slave devices, allowing for independent access and testing of individual chips in a stacked semiconductor system, improving integration and testing efficiency.
Implementation Method 1
a first transmission inductor pad configured to transmit data to a first reception inductor pad; a second transmission inductor pad configured to transmit a clock signal to a second reception inductor pad
Data Source
AI summary
A semiconductor device include: a first reception inductor pad through configured to receive data from a first transmission inductor pad; a second reception inductor pad configured to receive a clock from a second transmission inductor pad; and a data recovery unit configured to generate an output data.