Inductive Wafer Heating Zones for Uniform Liquid Processing
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Solution Overview
Problem
Conventional liquid processing apparatuses for semiconductor wafers face challenges in efficiently controlling temperature and uniform processing across different portions of the wafer, leading to variations in processing efficiency and effectiveness.
Innovation Solution
The apparatus incorporates a heating member with an insulating component, inductively heated by a coil, to control the temperature of specific portions of the wafer, along with a substrate holder and processing liquid supply system, allowing for precise temperature control and uniform processing across the wafer surface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a heating member is used to heat the substrate, then processing efficiency is improved, but temperature uniformity across different portions of the substrate deteriorates
Solution Approach 1:
The heating member is divided into multiple independent heating zones (first heating zone and second heating zone) that can be controlled separately. Each heating zone corresponds to different portions of the substrate, allowing independent temperature control to achieve both high processing efficiency and uniform temperature distribution across the substrate surface.
Solution Approach 2:
Different portions of the substrate receive different heating treatments through the segmented heating zones. The first heating zone heats one portion of the substrate while the second heating zone heats another portion, enabling localized temperature control that maintains temperature uniformity while improving overall processing efficiency.
2Manufacturing precision
If the entire substrate is heated uniformly, then processing consistency is improved, but energy consumption increases
Solution Approach 1:
The heating member is segmented into multiple independently controllable heating zones. This allows only the necessary portions of the substrate to be heated at any given time, rather than heating the entire substrate uniformly. The segmented design maintains processing consistency in the heated regions while reducing overall energy consumption.
Solution Approach 2:
Instead of heating the entire substrate uniformly (excessive action), the heating member applies heat only to specific portions of the substrate that require processing (partial action). This reduces energy consumption while maintaining processing consistency in the targeted areas.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables efficient and stable liquid processing by individually controlling the temperature of specific wafer portions, improving processing efficiency and uniformity, especially during operations like cleaning and etching.
Implementation Method 1
The coil is configured to heat the heating member inductively to heat the portion of the substrate
Data Source
AI summary
A liquid processing apparatus includes a heating member, a substrate holder, a processing liquid supply and a coil. The heating member is disposed adjacent to a portion of a substrate and has an insulating member. The substrate holder is configured to hold the substrate. The processing liquid supply is configured to supply a processing liquid onto the substrate held by the substrate holder. The coil is configured to heat the heating member inductively to heat the portion of the substrate.