3D Printed Inductive Winding Layout Without Through Connections
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Solution Overview
Problem
Existing planar transformers with stacked printed circuit boards suffer from inefficiencies such as material waste, power compatibility limitations due to through connections, and suboptimal use of available space, as well as material weaknesses from compressions and elongations.
Innovation Solution
The use of additive manufacturing methods to create inductive components with a conductive winding and insulating carrier, eliminating the need for through connections and allowing for precise, three-dimensional designs with optimal space utilization, using materials like copper and ceramic for enhanced conductivity and insulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of substance
If recesses are stamped out or milled to produce the planar transformer, then the component can be manufactured, but material cannot be reused and manufacturing precision is compromised
Solution Approach 1:
The patent replaces traditional mechanical stamping or milling processes with an additive manufacturing process. Instead of removing material through mechanical force (subtraction), the winding structure is built layer by layer using deposited conductive material. This substitution eliminates material waste while achieving high manufacturing precision, as the additive process can precisely control material placement without the tolerances limitations of mechanical cutting.
2Ease of manufacture
If through connections are used to connect individual turns of the winding, then the winding can be assembled, but power compatibility is limited due to points of constriction
Solution Approach 1:
The patent merges the winding structure with the carrier board into a unified integrated component. The conductive material is directly deposited onto the carrier board surface, creating continuous winding paths without discrete through connections. This integration eliminates the points of constriction that would otherwise limit power compatibility, while the carrier board itself provides the structural support and electrical connection functions.
Solution Approach 2:
The patent extracts and eliminates the through connections from the traditional planar transformer design. By removing these discrete connecting elements and replacing them with a continuous deposited conductive path, the design eliminates the bottlenecks in power flow that through connections create, thereby improving overall power compatibility.
3Ease of manufacture
If traditional planar transformer design is used, then the component can be assembled, but available space in the winding space cannot be used in an optimal manner
Solution Approach 1:
The patent transitions from a traditional two-dimensional planar winding layout to a three-dimensional deposited structure. By building the winding vertically layer by layer on the carrier board, the design utilizes the third dimension (height) to pack more turns and increase the effective winding density. This dimensional change maximizes the use of available space within the component footprint, achieving optimal space utilization while maintaining manufacturing simplicity.
Data Source
AI summary
In an embodiment an inductive component includes at least one spiral-shaped winding made of a conductive material and a carrier made of an insulating material, wherein the spiral-shaped winding is incorporated into the carrier.