Inductively Coupled Filter with Stacked Substrates
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Solution Overview
Problem
Existing inductively coupled filters occupy a large area on a single substrate due to the placement of coil inductors, which hinders miniaturization and cost-effectiveness.
Innovation Solution
The inductively coupled filter is designed with coil inductors on two separate substrates, forming an instrument transformer configuration, with a metal connection structure to connect the substrates and adjust mutual inductance, allowing for reduced area occupation and flexible adjustment of the filter's performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If all coil inductors are disposed on the same package substrate surface, then the filter can be implemented with adjustable mutual inductance, but a relatively large area is occupied on the substrate
Solution Approach 1:
The patent transitions from a two-dimensional planar arrangement of all coil inductors on a single substrate to a three-dimensional stacked configuration where coil inductors are distributed across multiple substrate layers. This vertical dimensionality change allows the filter to maintain its inductively coupled functionality while significantly reducing the footprint area on each individual substrate surface.
Solution Approach 2:
The filter structure is segmented into multiple independent substrate layers, each carrying specific coil inductors. This segmentation allows the coil inductors to be distributed across different spatial planes, reducing the area concentration on any single substrate while maintaining the necessary mutual inductance relationships through controlled coupling between layers.
2Length of moving object
If coil inductors are disposed adjacently on the same substrate surface, then mutual inductance can be adjusted to achieve good suppression effect, but the filter does not meet miniaturization requirements
Solution Approach 1:
By stacking substrates vertically, the patent achieves miniaturization in the horizontal plane (reducing length and width) while maintaining or enhancing the suppression effect through controlled mutual inductance between coil inductors on different layers. The vertical separation allows for optimized coupling without the area constraints of planar arrangements.
3Area of stationary object
If coil inductors are disposed on two separate substrates, then area occupation is reduced, but the structure becomes more complex requiring metal connection structures
Solution Approach 1:
The patent merges multiple substrate layers into an integrated stacked structure with metal connection structures that simultaneously provide electrical interconnections and mechanical support. This combining approach reduces the overall system complexity compared to managing separate substrate assemblies, while still achieving the area reduction benefits of distributed coil inductor placement.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces the area occupied by the filter on each substrate, enabling miniaturization and cost-effective production while maintaining adjustable mutual inductance for optimal performance.
Implementation Method 1
a coil inductor in the first circuit and a coil inductor in the second circuit form an instrument transformer
Data Source
AI summary
Embodiments of the present invention provide an inductively coupled filter and a WiFi module. The inductively coupled filter includes a first circuit, where the first circuit is disposed on a first substrate; and a second circuit, where the second circuit is disposed on a second substrate; and the first substrate and the second substrate are disposed opposite to each other, so that a coil inductor in the first circuit and a coil inductor in the second circuit form a mutual induction structure. In the inductively coupled filter in the embodiments of the present invention, the coil inductors are disposed on two substrates respectively. This can reduce an area occupied by the inductively coupled filter on each package substrate.