Inductor Wiring Anchor Structure for Thin Magnetic Layers
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Solution Overview
Problem
The existing inductor components face challenges in achieving sufficient adhesion between the inductor wiring line and the magnetic layer when directly laminated without an insulation substrate, due to material compatibility issues.
Innovation Solution
Incorporating a magnetic metal powder dispersed in an insulation material base, with an anchor portion extending from the inductor wiring line to cover the magnetic metal powder, ensuring direct contact and adhesion between the inductor wiring line and the magnetic layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If the insulation substrate is omitted to reduce component thickness, then the thickness is reduced, but adhesion between the inductor wiring line and magnetic layer becomes insufficient
Solution Approach 1:
The inductor wiring line is divided into a main body portion and an anchor portion that extends into the magnetic layer. This segmentation allows the wiring line to have both a functional main body and an adhesion-promoting anchor structure, resolving the contradiction between thin design and sufficient adhesion.
Solution Approach 2:
The anchor portion extends in the thickness direction (vertical dimension) into the magnetic layer, creating a three-dimensional structure. This dimensional transition from a flat two-dimensional wiring line to a three-dimensional anchor structure enables sufficient adhesion without increasing the overall planar area, thus maintaining thin component design.
2Reliability
If an insulation substrate is used to ensure adhesion, then adhesion is sufficient, but the component thickness increases
Solution Approach 1:
The insulation substrate is completely removed from the structure. Instead of using a separate insulation substrate layer, the magnetic layer itself serves as both the magnetic component and the adhesion substrate, with the anchor portion directly engaging the magnetic metal powder particles within it.
Solution Approach 2:
The functions of the insulation substrate and magnetic layer are merged into a single integrated magnetic layer structure. The magnetic layer simultaneously provides magnetic properties and serves as the substrate for adhesion, eliminating the need for a separate insulation substrate and reducing overall thickness.
3Ease of manufacture
If direct lamination is used without intermediate layers, then manufacturing is simplified, but adhesion is insufficient due to material incompatibility
Solution Approach 1:
The inductor wiring line has different properties in different regions: the main body portion has standard conductivity and insulation properties, while the anchor portion has enhanced adhesion properties by extending into and covering magnetic metal powder particles. This local differentiation enables direct lamination with sufficient adhesion.
Solution Approach 2:
The inductor wiring line functions as a composite structure combining conductive material for the main body with adhesion-promoting anchor portions that interact with magnetic metal powder. This composite approach enables direct contact with the magnetic layer while ensuring sufficient adhesion through the anchor effect.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances adhesion and ensures reliable contact between the inductor wiring line and the magnetic layer, allowing for a thinner inductor component design while maintaining necessary adhesion and insulation properties.
Implementation Method 1
a magnetic layer in which a magnetic metal powder is dispersedly present in a base material made of an insulation material
Implementation Method 2
the inductor wiring line includes an anchor portion extending from a main face in the inductor wiring line on a side of the magnetic layer and covering a surface of the magnetic metal powder in the magnetic layer
Data Source
AI summary
An inductor component including a magnetic layer in which a magnetic metal powder is dispersedly present in a base material made of an insulation material and an inductor wiring line laminated on a surface of the magnetic layer. The inductor wiring line includes an anchor portion extending from a main face of the inductor wiring line on a side of the magnetic layer and covering a surface of the magnetic metal powder in the magnetic layer.


