Inductor Array Substrate Layout for 3D Mounting Flexibility
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing inductor components face challenges in maintaining characteristics when miniaturized and embedded in substrates, particularly in three-dimensional mounting systems, due to limitations in wiring configuration and terminal placement, leading to unnecessary wiring routing and reduced flexibility in circuit design.
Innovation Solution
The inductor array component features a flat plate-shaped main body with magnetic layers, adjacent inductor wirings, and vertically extending wirings on both sides, allowing for improved connection flexibility and reduced physical and electrical differences between sides, along with a non-magnetic insulating layer and specific metal magnetic powder distribution to enhance inductance and mechanical strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If the inductor component uses a winding structure with coil diameter parallel to substrate thickness direction, then the inductor component can be embedded in substrate, but it is difficult to maintain inductor characteristics when substrate thickness is reduced
Solution Approach 1:
The patent changes the orientation of the inductor component from having the coil diameter parallel to the substrate thickness direction to having the coil diameter parallel to the substrate surface. This dimensional reorientation allows the inductor to maintain its characteristics even when substrate thickness is reduced, while still enabling embedding capability.
2Adaptability or versatility
If the inductor component has extended portion connected to side surface for surface mounting, then surface mounting is enabled, but unnecessary wiring routing is generated in three-dimensional mounting
Solution Approach 1:
The patent designs the inductor component with external terminals that can be exposed from both the upper surface and lower surface of the main body, making it universally adaptable to both surface mounting and three-dimensional mounting configurations. This multi-functionality eliminates the need for extended portions that would create unnecessary wiring routing in 3D mounting scenarios.
3Volume of moving object
If the inductor component is miniaturized and reduced in height, then size reduction is achieved, but characteristics of the inductor component deteriorate
Solution Approach 1:
The patent reorients the inductor component so that the coil diameter is parallel to the substrate surface rather than parallel to the thickness direction. This allows the inductor to maintain its electrical characteristics while reducing height, as the magnetic field generation occurs in the plane parallel to the substrate rather than along the thickness direction.
4Ease of operation
If external terminals are disposed closer to sides of side surfaces, then surface mounting is facilitated, but wiring routing becomes longer in three-dimensional mounting
Solution Approach 1:
The patent positions external terminals to be exposed from both the upper surface and lower surface of the inductor component main body. This universal terminal arrangement allows for short wiring routing in three-dimensional mounting by connecting from the upper or lower surface directly, while still facilitating surface mounting through the side-exposed terminals.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables improved inductance, mechanical strength, and flexibility in circuit design, reducing unnecessary wiring and allowing for efficient three-dimensional mounting while maintaining inductor component characteristics.
Implementation Method 1
a magnetic layer having resin and metal magnetic powder contained in the resin
Implementation Method 2
metal magnetic powder contained in the resin
Data Source
AI summary
An inductor array component includes a substantially flat plate-shaped main body including a magnetic layer having resin and metal magnetic powder contained in the resin, a first inductor wiring and a second inductor wiring disposed on the same plane in the main body and adjacent to each other, and a plurality of first vertical wirings extending in a first direction of a normal direction with respect to the plane so as to penetrate through inside of the main body and being exposed on a side of a first main surface of the main body. Also, the inductor array component includes a plurality of second vertical wirings extending in a second direction of the normal direction with respect to the plane so as to penetrate through the inside of the main body and being exposed on a side of a second main surface of the main body.