Integrated Inductor Array Cutting to Lower DC Resistance
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Solution Overview
Problem
The manufacturing process of small integrated inductors faces challenges such as high fluidity requirements for magnetic powder, difficulty in implanting windings into the mold cavity, and increased DC resistance due to processes like electroplating or silvering.
Innovation Solution
The method involves arranging a plurality of windings at intervals along a conductor, forming an inductor collection, and then cutting it to create power module components, which reduces the fluidity requirement for magnetic powder and eases the implantation of windings into the mold cavity, while also minimizing DC resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If high-pressure integral-molding method is used to manufacture small integrated inductors, then the inductors achieve small volume and high integration, but the fluidity requirement for magnetic powder becomes extremely high and implantation of windings into mold cavity becomes difficult
Solution Approach 1:
The patent divides the inductor manufacturing process into two stages: first forming a green compact with windings embedded, then performing integral molding after sintering. This segmentation allows windings to be implanted before the magnetic powder becomes dense, solving the implantation difficulty while achieving small final volume through the integral molding process.
Solution Approach 2:
The patent performs preliminary embedding of windings into the magnetic powder before integral molding. By placing windings in the green compact stage when magnetic powder is still loose, the windings can be easily positioned and fixed without requiring high fluidity during the actual molding process.
2Reliability
If electroplating or silvering processes are applied to terminals of small integrated inductors, then connection reliability is improved, but DC resistance increases by several times to more than ten times
Solution Approach 1:
The patent extracts the terminal processing step from conventional electroplating/silvering processes. Instead of adding coating layers that increase resistance, the method uses selective grinding to expose terminals directly from the sintered magnetic material, maintaining low DC resistance while ensuring reliable electrical connection.
Solution Approach 2:
The patent replaces the conventional coating approach (electroplating/silvering) with a direct exposure method. By grinding away the magnetic powder layer to expose the embedded winding terminals, the patent creates a direct metal-to-metal connection without intermediate coating layers, thus avoiding the resistance increase associated with plating processes.
3Productivity
If multiple inductors are integrated into one magnet with terminals at the bottom, then space utilization is improved, but the manufacturing complexity and processing difficulty increase significantly
Solution Approach 1:
The patent merges multiple inductor units into a single integrated magnet structure through the integral molding process. Multiple windings are embedded in different layers of the green compact, and after sintering and cutting, multiple functional inductors share a common magnetic body with terminals accessible at the bottom, achieving high integration without proportionally increasing manufacturing complexity.
Solution Approach 2:
The patent uses layered arrangement of windings in the green compact (adding a vertical dimension) to accommodate multiple inductors within a single magnet. By stacking windings in different layers and then cutting the sintered body, the patent creates multiple independent inductor pathways within one integrated structure, efficiently utilizing three-dimensional space.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively reduces the DC resistance of the inductor to 0.1-0.5 mΩ, enhances the integration level and efficiency of the power module components, and simplifies the manufacturing process by reducing the complexity of implanting windings and grinding small integrated inductors.
Implementation Method 1
a plurality of green compacts are placed in a mold cavity, and then pressed to be integrated into an inductor collection
Implementation Method 2
the inductor collection is placed in a sintering furnace for sintering
Implementation Method 3
a plurality of windings are designed to be arranged at intervals along the same direction on a conductor, and then separated into a plurality of power module components by cutting
Data Source
AI summary
Disclosed are a power module component, a manufacturing method therefor and an application thereof, and the manufacturing method comprises: forming an inductor collection; and cutting the inductor collection to obtain the power module component, where the power module component comprises a plurality of windings which are arranged at intervals along a first direction in sequence. In the present application, a plurality of windings are designed to be arranged at intervals along the same direction on a conductor, and then separated into a plurality of power module components by cutting, thereby reducing the fluidity requirement for magnetic powder, overcoming the difficulty in implanting windings into the mold cavity, and reducing the DC resistance of the inductor.