Inductor Framework Bottom Welding Layout for Smaller PCB Footprint
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Solution Overview
Problem
Current inductor devices for patch assembly are not sufficiently miniaturized, limiting their adaptability and competitiveness in electronic products.
Innovation Solution
The inductor framework features a main winding part with conductive welding components that cover and fix the winding, allowing wires to be accommodated without extending beyond a bonding surface, enabling a compact design by insulating and bonding directly with a circuit board, reducing the overall area occupied.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If traditional winding posts protruding from sides of inductor framework are used for patch assembly, then electrical connection and fixation with circuit board can be achieved, but the overall area occupied by the inductor device is large
Solution Approach 1:
The patent transitions from a horizontal lateral connection structure to a vertical downward connection structure. The conductive welding components are positioned on the bottom surface of the framework, enabling the inductor to be mounted vertically on the circuit board. This dimensional change reduces the horizontal footprint while maintaining electrical connection functionality.
Solution Approach 2:
The patent integrates multiple functions into the conductive welding components: electrical connection, mechanical fixation, and wire termination. By combining these functions into a single integrated component on the bottom surface, the design eliminates the need for separate protruding winding posts and reduces overall device area.
2Adaptability or versatility
If conductive welding components are added to cover the connection surface, then wire accommodation and bonding capability are improved, but device complexity increases
Solution Approach 1:
The conductive welding components serve multiple purposes simultaneously: they provide electrical connection to the circuit board, accommodate and terminate the winding wires, and serve as bonding surfaces for mounting. This multi-functionality reduces the need for additional separate components.
Solution Approach 2:
The framework's own bottom surface is utilized as the bonding surface by integrating conductive welding components directly onto it. This self-service approach eliminates the need for separate mounting structures or additional bonding layers, reducing overall complexity.
Data Source
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AI summary
The present disclosure discloses an inductor framework, an inductor device and a lamp. The inductor framework includes a main winding part and at least two conductive welding components; the main winding is configured to fix a winding and has a connection surface, the conductive welding components are under the connection surface and cover the connection surface, and the conductive welding components are in fixed connection with the main winding part and the at least two conductive welding components are insulated from each other; the conductive welding components have a wire accommodation region.