Inductor Mounting Box Structure for Cooling Plate Heat Dissipation

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Solution Overview

Problem

Existing energy storage converters face challenges in efficiently dissipating heat generated by inductors, leading to potential overheating and reduced performance.

Innovation Solution

The design incorporates a mounting box with heat dissipation protrusions and grooves that engage with a cooling plate, along with angled side walls and ribs to increase contact area and improve heat transfer, while using a liquid cooling medium that changes phase to enhance cooling efficiency.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If the inductor is placed in a cuboid inductor box on the cooling plate, then the structure is simple, but the heat dissipation area is limited and heat dissipation efficiency is poor

Engineering Contradiction:
Improveinductor temperatureVSAvoidheat dissipation area
Core Design Contradiction:
TemperatureVSArea of stationary object

Solution Approach 1:

The patent transforms the traditional cuboid inductor box into a triangular prism shape with inclined side walls. This dimensional change increases the contact area between the mounting box and the cooling plate, providing more heat dissipation area while maintaining structural simplicity.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent introduces heat dissipation protrusions and grooves at specific locations where heat generation is most intense. These localized structures increase the heat dissipation area precisely where needed, improving heat transfer efficiency without significantly increasing overall device complexity.

Inventive Principle:
Principle #3Local quality

2Temperature

If heat dissipation protrusions and grooves are added to increase contact area, then heat dissipation efficiency improves, but device complexity increases

Engineering Contradiction:
Improveheat dissipation efficiencyVSAvoidmounting box structure
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

The patent combines the heat dissipation protrusions and grooves with the mounting box structure itself, making the heat dissipation features integral to the mounting box rather than separate components. This integration improves heat dissipation efficiency while minimizing the increase in device complexity.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The mounting box serves multiple functions: it provides structural support for the inductor, acts as a heat dissipation component through its inclined walls and protrusions, and facilitates thermal contact with the cooling plate. This multi-functionality reduces the need for additional components, balancing heat dissipation improvement with device complexity.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Area of stationary object

If the side walls are made vertical for easy manufacturing, then manufacturing is simple, but the contact area with the cooling plate is reduced

Engineering Contradiction:
Improvecontact area with cooling plateVSAvoidmounting box fabrication
Core Design Contradiction:
Area of stationary objectVSEase of manufacture

Solution Approach 1:

The patent changes the side walls from vertical to inclined, forming a triangular prism shape. This dimensional change increases the contact area with the cooling plate. While this does increase manufacturing complexity slightly, the overall structure remains simple and can be manufactured using standard techniques.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration enhances heat dissipation, maintains inductor temperature within optimal ranges, and stabilizes the mounting box position, ensuring efficient operation and improved thermal management.

Implementation Method 1

The heat can be conducted to the cooling plate through the mounting box. The engagement of the heat dissipation protrusion with the heat dissipation groove increases an area of contact between the bottom wall and the cooling plate, thereby improving a heat dissipation effect

Methodology Applied
Scientific EffectHeat conduction: Conduction (thermal)

Implementation Method 2

a liquid cooling medium is received in the receiving cavity, the cooling medium being capable of being transformed to be a gaseous state when a preset temperature is reached

Methodology Applied
Scientific EffectPhase change: Phase Change

Implementation Method 3

The cooling plate absorbs the heat to cool the inductor so that the inductor can operate at an appropriate temperature

Methodology Applied
Scientific EffectHeat transfer: Conduction (thermal)

Data Source

PatentEP4700804A1Energy storage converter and energy storage device
Publication Date: 2026.02.25 ZHEJIANG JINKO ENERGY STORAGE CO LTD
  • EP4700804A1 patent drawingFigure 1
  • EP4700804A1 patent drawingFigure 2
  • EP4700804A1 patent drawingFigure 3

AI summary

The present disclosure relates to an energy storage converter and an energy storage device. The energy storage converter includes: a mounting box, an inductor, and a cooling plate. The mounting box includes a mounting cavity, the inductor is mounted in the mounting cavity, and the mounting box is mounted to the cooling plate. The mounting box includes a bottom wall, one of the bottom wall and the cooling plate is provided with a heat dissipation protrusion and the other one of the bottom wall and the cooling plate is provided with a heat dissipation groove. The heat dissipation protrusion is engaged with the heat dissipation groove. The mounting box includes a first side wall and a second side wall opposite to each other. The first side wall includes a first surface facing away from the second side wall, and the second side wall includes a second surface facing away from the first side wall. A distance between the first surface and the second surface gradually increases along a direction towards the cooling plate. In the present disclosure, heat generated by the inductor is absorbed by the cooling plate to cool the inductor. The engagement of the heat dissipation protrusion with the heat dissipation groove increases an area of contact between the bottom wall and the cooling plate and limits movement of the mounting box relative to the cooling plate. The area of contact between the bottom wall and the cooling plate is larger, so that heat exchange efficiency between the mounting box and the cooling plate is higher.