Inductor Component With Voids In Magnetic Layer

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Solution Overview

Problem

Inductor components in electronic devices face stress accumulation due to thermal expansion and contraction differences, leading to potential cracking and increased manufacturing costs from additional insulating structures required to maintain insulating properties.

Innovation Solution

An inductor component with a multilayer body containing a magnetic layer made of a base resin with voids, metal magnetic powder, and non-magnetic powder, where the metal magnetic powder is in contact with the voids and non-magnetic powder, reducing stress and improving insulating properties without the need for additional insulating coatings.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Stress or pressure

If the content of metal magnetic powder in the magnetic layer is increased to reduce stress, then stress reduction is achieved, but the insulating property deteriorates

Engineering Contradiction:
ImprovestressVSAvoidinsulating property
Core Design Contradiction:
Stress or pressureVSReliability

Solution Approach 1:

A resin layer is introduced as an intermediary substance between the metal magnetic powder particles. This resin layer has a thermal expansion coefficient matched to the magnetic layer, acting as a buffer that reduces stress while simultaneously providing electrical insulation. The resin fills the spaces between particles and coats their surfaces, preventing direct contact that would cause both stress concentration and insulation failure.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The thermal expansion coefficient of the resin layer is specifically selected to match that of the magnetic layer containing metal magnetic powder. By changing the parameter of the resin's thermal expansion coefficient to match the magnetic layer, stress is reduced during temperature cycles while maintaining insulating properties. This parameter matching prevents differential expansion stress.

Inventive Principle:
Principle #35Parameter changes

2Reliability

If additional insulating structures are added to maintain insulating property, then insulating property is maintained, but manufacturing cost and component size increase

Engineering Contradiction:
Improveinsulating propertyVSAvoidstructure
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The resin layer performs multiple functions simultaneously: it acts as an electrical insulator between metal magnetic powder particles, serves as a stress-reducing buffer by matching thermal expansion coefficients, and provides structural binding between particles. This multi-functionality eliminates the need for separate insulating structures, reducing both complexity and manufacturing cost.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The insulating function and stress reduction function are merged into a single resin layer component. Instead of having separate insulating coatings and stress management structures, the resin layer combines both functions by being in direct contact with metal magnetic powder particles and having matched thermal expansion properties, simplifying the overall structure.

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively reduces stress and enhances insulating properties, minimizing manufacturing costs and component size while maintaining reliability and performance.

Implementation Method 1

A spiral wiring line, an insulator, and a resin or a metal magnetic powder that is included in a magnetic layer expand and contract due to temperature changes, and the degrees of their expansion and contraction are different from one another. Thus, stress such as deformation due to heat may sometimes be accumulated.

Methodology Applied
Scientific EffectThermal expansion: Thermal Expansion

Implementation Method 2

the structure, the shape, the material, and so forth of the inductor wiring line are not particularly limited

Methodology Applied
Scientific EffectElectromagnetic induction: Electromagnetic Induction

Data Source

PatentUS11476036B2Inductor component
Publication Date: 2022.10.18 MURATA MFG CO LTD
  • US11476036B2 patent drawing
  • US11476036B2 patent drawing
  • US11476036B2 patent drawing

AI summary

An inductor component includes a multilayer body including a magnetic layer and a spiral wiring line disposed in the multilayer body. The magnetic layer includes a base resin, a metal magnetic powder, and a non-magnetic powder. The base resin has voids, and the metal magnetic powder and the non-magnetic powder are contained in the base resin. There is a particle of the metal magnetic powder that is in contact with at least one of the voids and with the non-magnetic powder.