Inductor External Electrodes Composite Plating Miniaturization
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Solution Overview
Problem
The increasing demand for smaller inductors in electronic devices poses a challenge as existing inductor designs struggle to maintain compact size without compromising inductance value or reliability.
Innovation Solution
The inductor design incorporates a body structure with external electrodes and a conductive structure, where each external electrode consists of an electroless plated layer and an electrolytic plated layer, with the electrolytic plated layer being formed of a material with higher rigidity and greater thickness, allowing for miniaturization without reducing inductance capacity and improving the Q value by minimizing parasitic capacitance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the inductor size is reduced to meet miniaturization requirements, then the compactness is improved, but the inductance value and reliability deteriorate
Solution Approach 1:
The external electrodes are constructed using composite plating structures combining electroless plated layers and electrolytic plated layers with different materials. This composite approach allows the electrodes to maintain sufficient conductivity and mechanical strength even when the overall inductor size is reduced, thereby preserving reliability while achieving miniaturization.
Solution Approach 2:
The patent optimizes the thickness parameters of different plated layers in the external electrodes. By carefully controlling the thickness of each layer (electroless and electrolytic plating), the design achieves a balance between reducing overall size and maintaining the electrical and mechanical properties necessary for reliable operation.
2Ease of manufacture
If the external electrode structure is simplified to reduce manufacturing complexity, then the ease of manufacture is improved, but the rigidity and reliability deteriorate
Solution Approach 1:
The electroless plated layer is formed first as a preliminary step before applying the electrolytic plated layer. This preliminary action creates a stable foundation that ensures uniform coverage and adhesion, allowing for simplified subsequent manufacturing steps while maintaining electrode rigidity and reliability.
Solution Approach 2:
The combination of electroless and electrolytic plated layers with different materials provides both manufacturing simplicity and structural strength. The electroless layer ensures uniform coverage, while the electrolytic layer adds rigidity, achieving both ease of manufacture and mechanical strength through material composition rather than complex structures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enables the creation of a compact inductor with increased rigidity and improved reliability, maintaining high inductance value and minimizing parasitic capacitance, thus enhancing the performance and miniaturization of electronic devices.
Implementation Method 1
each of the first and second external electrodes includes an electroless plated layer and an electrolytic plated layer
Implementation Method 2
the electrolytic plated layer being formed of a material different from a material of the electroless plated layer and covering the electroless plated layer
Data Source
AI summary
An inductor includes a body structure, a first external electrode and a second external electrode disposed externally on the body structure and spaced apart from each other, and a conductive structure disposed inside the body structure and including a first end portion in contact with the first external electrode and a second end portion in contact with the second external electrode, wherein each of the first and second external electrodes includes an electroless plated layer and an electrolytic plated layer formed of a material different from that of the electroless plated layer and covering the electroless plated layer.