Multilayer Inductor Circuit With Connection Capacitor for Low Coupling
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
In electronic components with multiple inductors on a substrate, coupling between inductors leads to undesired frequency characteristics, and increasing the distance between them results in increased chip size and reduced inductance.
Innovation Solution
Incorporating a connection capacitor with specific capacitor electrodes connected to inductor winding patterns to reduce the influence of coupling between inductors, using interlayer insulating films to achieve a minute capacitance that maintains desired frequency characteristics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If the distance between inductors is increased to reduce coupling, then the coupling influence is reduced, but the chip size increases and inductance decreases
Solution Approach 1:
A connection capacitor is introduced as an intermediary element between the two inductors. This capacitor provides a controlled impedance path that compensates for the coupling effect between inductors, allowing them to be placed closer together without suffering from harmful coupling influences. The capacitor acts as a mediator that balances the electromagnetic interaction between adjacent inductors.
Solution Approach 2:
The invention changes the electrical parameters by introducing a capacitor with specific capacitance value between the inductors. This parameter modification alters the impedance characteristics of the inductor interconnection, transforming the coupling effect from harmful to useful, and enabling closer inductor placement while maintaining desired frequency characteristics.
2Object-affected harmful factors
If the distance between inductors is increased to reduce coupling, then the coupling influence is reduced, but the inductance decreases
Solution Approach 1:
The connection capacitor serves as a mediator that preserves the inductance value by providing an alternative current path. When inductors are placed closer together, the capacitor compensates for the increased coupling by adjusting the overall impedance, thereby maintaining the effective inductance despite reduced physical separation.
3Area of stationary object
If inductors are placed close together to reduce chip size, then the chip size decreases, but the coupling influence increases
Solution Approach 1:
The connection capacitor is positioned between closely-spaced inductors to mediate their electromagnetic interaction. By providing a controlled impedance path, the capacitor allows the inductors to be placed close together for miniaturization while compensating for the increased coupling effect, thus resolving the contradiction between small size and low coupling.
4Area of stationary object
If inductors are placed close together to reduce chip size, then the chip size decreases, but the frequency characteristics deteriorate
Solution Approach 1:
The connection capacitor acts as an intermediary that preserves frequency characteristics by controlling the impedance between closely-spaced inductors. The capacitor's presence modifies the resonant behavior and frequency response of the inductor combination, allowing compact placement while maintaining desired frequency performance.
Solution Approach 2:
By introducing a capacitor with specifically designed capacitance value, the electrical parameters of the inductor interconnection are changed. This parameter modification adjusts the impedance characteristics and frequency response, enabling close inductor placement without deteriorating frequency characteristics.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves steep attenuation characteristics and prevents separation of attenuation poles, maintaining adequate frequency performance while minimizing the inductor coupling effect.
Implementation Method 1
a connection capacitor connected between the first and second circuit patterns. The connection capacitor has first and second capacitor electrodes
Implementation Method 2
a first winding pattern constituting the first inductor
Data Source
AI summary
To reduce, in an electronic component having a structure in which a plurality of inductors are provided on a substrate, the influence of coupling between the inductors. An electronic component has a circuit pattern including an inductor, a circuit pattern including an inductor, and a connection capacitor connected between the circuit patterns. The connection capacitor has capacitor electrodes, and the capacitor electrode is connected to a winding pattern constituting the inductor.