Inductor Core as MIM Capacitor Bottom Electrode
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Solution Overview
Problem
The complexity of modern electronic devices requires miniaturization of RF components, necessitating a novel method to combine the fabrication steps of capacitors and inductors to reduce fabrication time and costs.
Innovation Solution
A structure with an inductor and a metal-insulator-metal (MIM) capacitor is fabricated using a dielectric layer, where the inductor core serves as the bottom electrode of the MIM capacitor, sharing material composition and reducing fabrication steps.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If separate fabrication processes are used for capacitors and inductors, then each component can be optimized independently, but fabrication time and costs increase
Solution Approach 1:
The patent combines the fabrication processes for capacitors and inductors into a single integrated process. The inductor core and capacitor bottom electrode are formed simultaneously from the same deposited material layer, eliminating sequential processing steps and reducing overall fabrication time while maintaining component optimization through selective patterning
Solution Approach 2:
The patent creates a multi-functional material layer that serves dual purposes: forming both the inductor core and the capacitor bottom electrode. This universal material layer approach allows a single deposition process to fulfill multiple component requirements, improving productivity without sacrificing manufacturing precision
2Manufacturing precision
If separate fabrication processes are used for capacitors and inductors, then each component can be optimized independently, but fabrication costs increase
Solution Approach 1:
The patent merges capacitor and inductor fabrication into one process flow, where the same material deposition and processing steps serve both components. This consolidation reduces the total number of fabrication steps, equipment usage, and processing time, thereby lowering manufacturing costs while maintaining the ability to optimize each component's specific requirements
Solution Approach 2:
By designing a universal material layer that functions as both inductor core and capacitor electrode, the patent eliminates redundant fabrication steps. This multi-functional approach reduces material waste, processing time, and equipment requirements, directly reducing fabrication costs while preserving component optimization capabilities
Data Source
AI summary
A structure with an inductor and a MIM capacitor is provided. The structure includes a dielectric layer, an inductor and a MIM capacitor. The inductor and the MIM capacitor are disposed within the dielectric layer. The inductor includes a core and a wire surrounding the core. The MIM capacitor includes a top electrode, a bottom electrode and an insulating layer. The top electrode or the bottom electrode includes a material which forms the core.