Inductor Core Stacks Using SAM Dielectrics for ECD Layering
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Solution Overview
Problem
Existing inductor manufacturing processes produce low-performance inductors that are costly and time-consuming, limiting yield and efficiency.
Innovation Solution
The formation of multi-layer inductor core stacks using self-assembled monolayer (SAM) dielectrics, where magnetic and dielectric layers are alternately deposited in a single chamber through electrochemical deposition (ECD) and SAM processes, allowing for tunable dielectric thickness and material adjustments.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional inductor manufacturing processes are used, then inductors can be produced, but the performance is low and manufacturing costs are high
Solution Approach 1:
The patent changes the dielectric material parameters by using self-assembled monolayers with specific molecular structures (thiol, silane, or phosphonic acid head groups) and controlled thickness (1-10 nm), which fundamentally alters the electrical and magnetic properties of the inductor core, enabling high performance at lower cost
Solution Approach 2:
The patent creates a composite structure by combining magnetic layers (permalloy, cobalt ferrite, or magnetite) with organic self-assembled monolayer dielectrics, forming a multi-layer composite material system that achieves superior inductor performance through the synergistic properties of both materials
2Reliability
If traditional multi-layer inductor manufacturing processes are used, then inductors can be produced, but the process is time consuming and yield is reduced
Solution Approach 1:
The patent performs preliminary actions by pre-treating magnetic layer surfaces (oxidation, plasma treatment, or chemical etching) before depositing the SAM dielectric layers, ensuring optimal adhesion and interface properties that prevent manufacturing defects and improve yield
Solution Approach 2:
The self-assembled monolayer acts as an intermediary layer between magnetic layers, providing a controlled interface that facilitates electron tunneling while maintaining dielectric isolation, thereby enabling high-performance inductors with improved manufacturing reliability
3Reliability
If SAM dielectric layers are deposited between magnetic layers, then inductor performance increases, but process complexity increases
Solution Approach 1:
The patent employs self-assembled monolayers that automatically organize into ordered structures when exposed to vapor or liquid precursors, eliminating the need for complex deposition equipment and processes while achieving precise thickness control and uniform coverage
Solution Approach 2:
The patent replaces complex mechanical deposition systems with vapor-phase or liquid-phase self-assembly processes, where molecular diffusion and self-organization replace mechanical layer-by-layer deposition, significantly simplifying the manufacturing equipment requirements
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enhances inductor performance and reduces manufacturing costs by enabling flexible, cost-effective production of high-performance inductors suitable for high-frequency and high-current applications.
Implementation Method 1
depositing a first dielectric layer on a first magnetic layer of the multi-layer inductor core where the first dielectric layer is a first self-assembled monolayer (SAM) layer
Implementation Method 2
a second magnetic layer that is deposited on the first dielectric layer using an electrochemical deposition (ECD) process
Implementation Method 3
an annealing process that is performed in situ at a temperature of approximately 100 degrees Celsius to approximately 200 degrees Celsius after depositing of the first dielectric layer
Data Source
AI summary
A method for forming a multi-layer inductor core incorporates a leaky self-assembled monolayer (SAM) as a plateable dielectric layer that is interposed between magnetic layers formed by electrochemical deposition (ECD) plating processes. A method may include depositing a dielectric layer on a first magnetic layer of an inductor core stack where the dielectric layer is a SAM layer and depositing a second magnetic layer on the dielectric layer of the multi-layer inductor core. The method may be repeated to form as many layers as desired. Subsequent dielectric layers may be the same SAM layer or a different SAM layer. A mix of different molecules may be used in the SAM layers to form the dielectric layers.