Multilayer Chip Inductor Corner Design for Chipping Resistance
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Solution Overview
Problem
Multilayer chip inductors are prone to chipping during the barrel polishing process due to the reduced distance between outer electrodes and the surface, which is a result of the thickness of the insulating layers being minimized for miniaturization.
Innovation Solution
The electronic component features a multilayer body with a design where the outer electrodes protrude in the laminating direction, creating a longer distance between the electrodes and the side surfaces in corners, thereby reducing the likelihood of chipping. This design includes a series of substantially rectangular insulating layers with outer electrodes exposed across the boundary between the bottom and end surfaces, connected to a circuit element, and the distance between the electrodes and side surfaces is increased to enhance structural integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the thickness of insulating layers is reduced to minimize the size of the multilayer chip inductor, then miniaturization is achieved, but chipping occurs in the multilayer body during barrel polishing process
Solution Approach 1:
The insulating layer thickness is made non-uniform: thinner in the central region (between outer electrodes) for miniaturization, and thicker in the corner regions for chipping resistance. This local differentiation allows simultaneous achievement of small size and high reliability.
Solution Approach 2:
The problem is solved by considering the third dimension (depth/thickness of insulating layers at different locations) rather than uniformly reducing all dimensions. By varying the thickness in the depth direction at different planar positions, both miniaturization and chipping resistance are achieved.
2Length of moving object
If the distance between outer electrodes and the surface is reduced for miniaturization, then the inductor size is minimized, but chipping occurs in portions above or below the outer electrode
Solution Approach 1:
The insulating layer thickness is locally optimized: thinner where space is needed (central regions) and thicker where strength is needed (corner regions supporting the outer electrodes). This resolves the contradiction between compact dimensions and structural strength.
3Strength
If insulating layers are laminated on upper and lower sides of outer electrodes, then the outer electrodes are protected, but the distance between electrodes and surfaces increases reducing miniaturization
Solution Approach 1:
Different insulating layer thicknesses are applied at different locations: minimal thickness in central regions to maintain compact size, and increased thickness in corner regions to protect outer electrodes and prevent chipping. This selective approach resolves the size-protection tradeoff.
Solution Approach 2:
The solution moves from uniform thickness in the planar dimension to variable thickness in the depth dimension, allowing protection and miniaturization to coexist by exploiting the third dimension strategically.
Data Source
AI summary
A multilayer body is a lamination of a plurality of substantially rectangular insulating layers and has a bottom surface being a series of the outer edges of the insulating layers, an end surface being adjacent to the bottom surface and being a series of the outer edges of the insulating layers, and a side surface located on a negative side in the y-axis direction. An outer electrode is embedded in the multilayer body such that it is exposed while extending across the boundary between the bottom surface and the end surface. A coil is disposed in the multilayer body and is connected to the outer electrode. The distance between the outer electrode and the side surface in the corner between the bottom surface and the end surface is longer than the distance between the outer electrode and the side surface where the outer electrode and the coil are connected.