Inductor Covering Electrode Layout for Dense PCB Mounting
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Solution Overview
Problem
The existing inductor components with non-uniform covering electrode thicknesses can interfere with other electronic components, hindering high-density mounting due to protrusions, which requires significant spacing and reduces component density on substrates.
Innovation Solution
The inductor component design features a first and second covering electrode with maximum thickness shifted towards the main surface side of the element body, avoiding interference by ensuring the electrodes' geometric centers are aligned differently, and a manufacturing method involving a laminate forming, firing, and plating process to achieve this configuration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the covering electrode is made thick to ensure adequate coverage and electrical connection, then the reliability of electrical connection is improved, but the component interferes with other electronic components and high-density mounting is hindered
Solution Approach 1:
The covering electrode is designed with non-uniform thickness distribution, where the thickness varies in different regions. Specifically, the thickness is greater at the ends and smaller at the center, allowing adequate coverage and electrical connection where needed while reducing interference with adjacent components in other regions.
Solution Approach 2:
The covering electrode structure employs asymmetric thickness distribution rather than uniform thickness. The electrode thickness is intentionally made different at various positions along its length, creating an asymmetric profile that optimizes both electrical connection reliability and spatial compatibility with neighboring components.
2Ease of manufacture
If uniform thickness covering electrodes are used, then the manufacturing process is simplified, but interference with other components occurs and component density is reduced
Solution Approach 1:
Instead of uniform thickness throughout, the covering electrode implements local quality variations with different thicknesses at different positions. This allows the manufacturing process to remain relatively simple while achieving the desired outcome of reduced interference and increased component density through strategic thickness variation.
3Reliability
If the covering electrode protrudes significantly to ensure adequate coverage, then the electrical connection is more reliable, but the required spacing between components increases
Solution Approach 1:
The covering electrode uses local quality variation with non-uniform thickness distribution. By concentrating greater thickness at the ends where electrical connection is critical and reducing thickness at the center, the design achieves reliable electrical connection with minimal protrusion, thereby reducing the spacing required between adjacent components.
Solution Approach 2:
The asymmetric thickness profile of the covering electrode, with greater thickness at ends and smaller thickness at center, optimizes the balance between electrical connection reliability and component spacing. This asymmetric design ensures adequate coverage where needed while minimizing the overall footprint and spacing requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively suppresses interference between inductor components and other electronic components, enabling higher component density on substrates by aligning the electrodes' thicknesses to avoid protrusions and reduce stray capacitance.
Implementation Method 1
a firing step of firing the laminate to form an element body including a first buried electrode in which the first conductive portion is sintered and a second buried electrode in which the second conductive portion is sintered
Implementation Method 2
a plating step of plating surfaces of the first buried electrode and the second buried electrode exposed to a surface of the element body to form a first covering electrode covering the surface of the first buried electrode and a second covering electrode covering the surface of the second buried electrode
Data Source
AI summary
To suppress interference between an inductor component and other electronic components, in the inductor component, the distance from the first end surface to the surface of the first covering electrode in the direction perpendicular to the first end surface is defined as the thickness of the first covering electrode. On a second virtual line that passes through a geometric center of the first end surface and is perpendicular to a first main surface, a position where the thickness of the first covering electrode is maximum is shifted toward the first main surface side with respect to the geometric center of the first end surface.


