Power Inductor Heat Dissipation via Embossed Magnetic Cladding
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Solution Overview
Problem
Conventional power inductors for high-current, high-power applications experience increased temperatures, which can destabilize electronic systems, and relying on additional heat dissipation devices increases costs, diminishing product competitiveness.
Innovation Solution
A power inductor with a heat dissipating structure featuring embossed patterns on a magnetic cladding that increases the surface area without obstructing magnetic flux lines, allowing for effective heat dissipation without additional cooling devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If additional heat dissipating devices such as heat pipe or liquid cooling device are arranged in the system, then heat dissipation efficiency is improved, but device complexity and cost increase
Solution Approach 1:
The patent combines the heat dissipation function with the magnetic cladding structure by integrating embossed patterns directly into the cladding. This merging eliminates the need for separate heat dissipation devices while maintaining effective heat dissipation, thereby reducing device complexity and cost.
Solution Approach 2:
The magnetic cladding is designed to serve dual functions: providing magnetic shielding and facilitating heat dissipation through its embossed surface patterns. This multi-functionality allows the single component to address both magnetic and thermal management requirements without adding extra devices.
2Temperature
If additional heat dissipating devices such as heat pipe or liquid cooling device are arranged in the system, then heat dissipation efficiency is improved, but cost increases
Solution Approach 1:
The patent combines the heat dissipation function with the magnetic cladding structure by integrating embossed patterns directly into the cladding. This merging eliminates the need for separate heat dissipation devices while maintaining effective heat dissipation, thereby reducing device complexity and cost.
3Temperature
If embossed patterns are formed on the surface of the inductor, then heat dissipation is improved, but magnetic flux distribution may be adversely affected
Solution Approach 1:
The embossed patterns are designed with specific geometric characteristics (cone, cuboid, column shapes with controlled dimensions) that create localized surface area increases without significantly disrupting the overall magnetic flux path. The patterns are optimized to maintain magnetic circuit integrity while providing effective heat dissipation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The embossed pattern design reduces surface temperature rise by 10-15% and increases rated current by 16% compared to conventional planar inductors, enhancing performance while maintaining magnetic circuit efficiency.
Implementation Method 1
a heat dissipating structure of embossed patterns formed on the surface of the magnetic material; wherein, any one of the embossed patterns is formed as a shape selected from the group consisting of a cone, a cuboid, a column
Implementation Method 2
the concaves of the cladding, caused by the embossed patterns, are not blocking the magnetic flux lines generating from the current inside the conducting wire for keeping the distribution of magnetic flux at minimum magnetic reluctance
Data Source
AI summary
The present invention relates to a power inductor having a heat dissipating structure formed on the surface thereof, which comprises: at least a conducting wire; and a cladding, made of a magnetic material for wrapping the conductive wire, having the heat dissipating structure of embossed patterns formed on the surface thereof. Preferably, the embossed pattern can be a cone, a cuboid, a column, or the combination thereof. Moreover, the length of any edge or the diameter of any one of the embossed patterns is about 1%˜50% of that of the power inductor, and the height of any one of the embossed patterns is about 1%˜50% of the thickness of the power inductor.