Inductor Fin Structures for Circuit Board Heat Dissipation
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Solution Overview
Problem
As microprocessors and electronic circuit components become more powerful and compact, they generate increasing amounts of heat, posing a risk of damage and reducing their lifespan due to inadequate heat dissipation in smaller volumes.
Innovation Solution
A circuit assembly design featuring an inductor with ferromagnetic body and fin structures that dissipate heat efficiently by thermally coupling a metal core circuit board to conductors extending from a package mold, facilitating heat transfer through conductive portions and terminals.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If integrated circuit components are made more powerful and compact, then processing capability and power increase, but heat generation increases and heat dissipation becomes more difficult
Solution Approach 1:
The patent transitions from planar heat dissipation to three-dimensional heat dissipation by extending fin structures vertically from the circuit board. These fins project into the enclosure space, creating additional heat dissipation surfaces in the vertical dimension, thereby increasing the effective heat dissipation area without expanding the horizontal footprint of the device.
Solution Approach 2:
The patent applies different thermal management strategies to different regions of the circuit assembly. High-heat-generation components are positioned near the fin structures for direct thermal coupling, while other areas use conventional heat dissipation methods. This localized approach optimizes heat removal from critical components without unnecessarily complicating the entire system.
2Volume of moving object
If device size is reduced, then space efficiency improves, but heat dissipation capacity decreases
Solution Approach 1:
The fin structures exploit the vertical dimension within the device enclosure to create extensive heat dissipation surfaces. By projecting fins upward from the circuit board into the available vertical space, the patent achieves high heat dissipation capacity without increasing the horizontal footprint, thus maintaining compact device dimensions while improving thermal management.
Solution Approach 2:
The fin structures are integrated within the existing device enclosure space, nesting the heat dissipation system within the available volume. The fins are positioned to utilize unused vertical space inside the enclosure, effectively nesting the thermal management system within the overall device structure without requiring additional external volume.
3Temperature
If heat dissipation structures are added, then heat removal efficiency improves, but device complexity increases
Solution Approach 1:
The fin structures are integrated directly with the circuit board, merging the mechanical support function of the board with the thermal management function of the fins. This combination eliminates the need for separate heat sinks or cooling assemblies, reducing overall device complexity while maintaining effective heat dissipation.
Solution Approach 2:
The fin structures serve multiple functions: they provide thermal conduction paths from high-heat components, create convection surfaces for heat dissipation, and can potentially serve as structural reinforcement elements. This multi-functionality reduces the need for additional dedicated components, thereby limiting the increase in device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively manages heat dissipation in a low-profile, space-efficient manner, preventing component damage and extending equipment lifespan by efficiently transferring heat away from high-capacity circuit components.
Implementation Method 1
the metal core is thermally coupled to transfer heat from one or more circuit components of the packaged device to the first conductor
Implementation Method 2
the first conductor forms fin structures on respective sides of the ferromagnetic body
Implementation Method 3
fin structures that dissipate heat efficiently
Data Source
AI summary
Techniques and mechanisms for providing efficient heat dissipation by a circuit assembly. In an embodiment, the circuit assembly includes an inductor and a packaged device coupled thereto, where the inductor forms heat dissipation structures on various respective sides of a ferromagnetic body. The packaged assembly includes a circuit board disposed in a mold material, where a metal core of the circuit board is thermally coupled to transfer heat from one or more circuit components of the packaged device to the inductor via one or more conductors extending from the package mold. In another embodiment, portions of the metal core have different respective vertical spans which contribute to different thermal conductivity characteristics across various regions of the circuit board.