Inductor Framework Layout for PCB Area Reduction
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Solution Overview
Problem
Conventional inductor frameworks with pins occupy a large area on the printed circuit board (PCB) due to the need for a bonding pad region to accommodate pins, limiting space efficiency.
Innovation Solution
An inductor framework design with auxiliary winding parts that allow the auxiliary coils to cover the welding surface on the PCB, eliminating the need for a dedicated pin passage area, and incorporating a position limiting structure to secure the coils in place.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If a conventional inductor core structure with through-holes for wire passing is used, then wire insertion and connection are simplified, but structural integrity and mechanical strength deteriorate due to the holes creating weak points
Solution Approach 1:
The core is divided into multiple stacked laminations rather than being a single solid piece. Each lamination is electrically isolated from others by insulating coatings, creating a segmented structure that maintains mechanical strength while providing wire passage pathways between layers without compromising overall integrity.
Solution Approach 2:
The wire is nested within the core structure by passing through stacked laminations in a layered configuration. The wire is embedded between the laminations rather than creating holes through the entire core structure, maintaining the strength of each individual lamination while providing secure wire retention.
2Strength
If the core structure is made more robust to improve mechanical strength, then structural integrity improves, but wire passage capability and ease of connection deteriorate
Solution Approach 1:
The wire passage problem is solved by transitioning from a two-dimensional through-hole approach to a three-dimensional layered structure. Wires pass through multiple laminations in sequence, utilizing the vertical stacking dimension to provide passage routes that do not compromise the planar strength of individual laminations.
3Strength
If solid iron pieces are used to form the core, then mechanical strength and magnetic properties improve, but eddy current losses increase due to large conductive paths
Solution Approach 1:
The core is segmented into multiple thin laminations stacked together, with each lamination electrically isolated by insulating coatings. This segmentation breaks up the large conductive paths present in solid iron, restricting eddy currents to smaller loops within each thin lamination and significantly reducing eddy current losses while maintaining mechanical strength through the stacked structure.
4Loss of energy
If insulation coating is applied to each lamination to reduce eddy currents, then energy loss from eddy currents decreases, but manufacturing complexity and production time increase
Solution Approach 1:
A uniform insulating coating is applied consistently to each lamination surface. This homogeneous coating provides reliable electrical isolation without requiring complex variable thickness profiles or multiple different coating materials, simplifying the manufacturing process while effectively reducing eddy current losses.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Significantly reduces the PCB area required for inductor assembly by allowing the bonding pad to be hidden under the inductor device, enhancing space efficiency and stability.
Implementation Method 1
an inductor includes a coil and a core, the coil being wound around the core
Data Source
Figure 1
Figure 2
Figure 3~4
AI summary
The present application provides an inductor framework and inductance device. The inductor framework includes a main winding part and an auxiliary winding part that are integrally arranged; the main winding part includes an upper end, a lower end, a main body, and an inserting hole; the main body is located between the upper end and the lower end, the inserting hole successively passes through the upper end, the main body, and the lower end in a direction from the top surface to the bottom surface; the auxiliary winding part extends from the lower end, a side surface of the auxiliary winding part facing away from the upper end is a welding surface; the auxiliary winding part is configured to be wound thereon an auxiliary coil which at least covers a portion of the welding surface, the auxiliary winding part is provided with a position limiting structure. The inductance device includes a main coil, an auxiliary coil, an upper magnetic core, a lower magnetic core, and an inductor framework, the main coil is wound in the main winding groove, the auxiliary coil is wound around the auxiliary winding part and covers a portion of the welding surface; the upper magnetic core is capped onto the top surface, the lower magnetic core is capped onto the bottom surface, a side surface of the lower magnetic core facing away from the upper magnetic core does not go beyond the welding surface. The inductor framework and the inductor device provided by this embodiment can save the area of PCB.