3D Inductor Heat Sink Assembly for Inductance and Cooling
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Solution Overview
Problem
Conventional power modules have limited volume utilization, low inductance, and poor cooling performance, which restricts the density of circuitry and efficiency in energy conversion, especially in power converter circuits.
Innovation Solution
The implementation of a heat sink assembly with electrically conductive elements and magnetic permeable materials, where the heat sink element is fabricated with orthogonal protrusions and voids to enhance inductance and cooling, forming a unique heat sink-circuit path assembly that increases inductance and cooling performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If conventional planar PCB layout is used, then ease of manufacture is maintained, but volume utilization and circuit density are limited
Solution Approach 1:
The patent transitions from conventional planar PCB layout to a three-dimensional power module assembly. The inductor is constructed with vertical stacking of magnetic cores and windings, utilizing the Z-dimension to achieve higher circuit density and volume utilization while maintaining manufacturability through standardized assembly processes.
2Temperature
If conventional power module layout is used, then ease of manufacture is maintained, but cooling performance is poor
Solution Approach 1:
The patent integrates the cooling function directly into the inductor structure by incorporating a heat sink as an integral component. The heat sink is thermally coupled to the switching devices and inductor windings, combining thermal management with the electrical function in a single manufactured assembly, thereby improving cooling performance without significantly complicating the manufacturing process.
3Quantity of substance
If maximum volume utilization is achieved, then inductance is maximized, but cooling performance may be compromised
Solution Approach 1:
The patent applies different material properties and structural characteristics to different regions of the inductor assembly. The magnetic cores provide high permeability in the magnetic circuit path to maximize inductance, while the heat sink regions provide high thermal conductivity to optimize cooling. This localized optimization of material properties allows simultaneous achievement of high inductance and effective thermal management.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution allows for the fabrication of high-density circuits with improved inductance and cooling performance, optimizing energy conversion efficiency and reducing the carbon footprint by maximizing the use of available space and energy.
Implementation Method 1
magnetic permeable material including: i) a first void extending between a first surface of the magnetic permeable material and a second surface of the magnetic permeable material; and ii) a second void extending between the first surface of the magnetic permeable material and the second surface of the magnetic permeable material
Implementation Method 2
a heat sink element fabricated from electrically conductive material; a first element of electrically conductive material fixedly connected to the heat sink element
Data Source
AI summary
An apparatus and method as discussed herein includes a heat sink element fabricated from electrically conductive material. A first element of electrically conductive material may be fixedly connected to the heat sink element. A second element of electrically conductive material may be fixedly connected to the heat sink element. The first element and the second element may extend substantially orthogonal from a surface of the heat sink element.