Inductor Insulator Composition for High-Q and Strength Balance
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Solution Overview
Problem
Inductor components with glass-based insulating materials face challenges in balancing strength and Q-value at high frequencies, as the addition of crystalline fillers enhances strength but increases dielectric loss and impairs surface smoothing during sintering.
Innovation Solution
The inductor component design incorporates a filler-poor glass portion with reduced crystalline filler content around the inner electrode, utilizing an amorphous material containing B, Si, and K, which reduces dielectric loss and increases the Q-value by allowing liquid-phase sintering and enhancing surface smoothness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If crystalline filler is added to glass-based insulating material, then strength is enhanced, but dielectric loss increases and Q-value is not sufficiently increased
Solution Approach 1:
The patent applies local quality by creating a filler-poor glass portion with lower crystalline filler content (5-30 wt%) in specific regions adjacent to inner electrodes, while other portions contain higher filler content (30-60 wt%). This spatial variation in filler concentration allows regions near electrodes to exhibit low dielectric loss and high Q-value, while other regions provide mechanical strength through higher filler content.
2Strength
If crystalline filler is added to glass-based insulating material, then strength is enhanced, but surface smoothing during sintering is impaired
Solution Approach 1:
The patent creates a filler-poor glass portion with reduced crystalline filler content in regions adjacent to inner electrodes, which facilitates liquid-phase sintering and surface smoothing in these critical areas. The lower filler concentration allows better fluidity of the glass phase during sintering, enabling effective surface smoothing without compromising overall component strength provided by other regions with higher filler content.
3Loss of energy
If amorphous material is used around inner electrode, then dielectric loss is reduced and Q-value is increased, but strength may be reduced
Solution Approach 1:
The patent implements local quality by using amorphous material or filler-poor glass portions with lower crystalline filler content (5-30 wt%) specifically in regions adjacent to inner electrodes where low dielectric loss is critical for high-frequency performance. Other portions of the insulating material contain higher filler content (30-60 wt%) to provide mechanical strength, thus achieving both low loss and high strength through spatially differentiated material composition.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively enhances the strength of the inductor component while reducing dielectric loss and increasing the Q-value at high frequencies, improving the component's performance and reliability.
Implementation Method 1
since the melting temperature of the crystalline filler is high, addition of the crystalline filler increases the rheology of a liquefied glass phase in a high-temperature range. As a result, smoothing of the conductor surface is impaired
Implementation Method 2
a measure such as the addition of a crystalline filler to the glass-based insulating material is taken. The crystalline filler contains a specific amount of alumina particles and a specific amount of zirconia particles
Data Source
AI summary
An inductor component includes an element assembly formed of an insulator material and an inner electrode arranged in the element assembly. The insulator material contains a base material formed of an amorphous material containing B, Si, O, and K and a crystalline filler and includes a filler-poor glass portion in a region along the inner electrode. The content of the crystalline filler in the filler-poor glass portion is lower than the content of the crystalline filler in the element assembly excluding the filler-poor glass portion.