Inductor Insulator Thickness Ratio for Plating Stability
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Solution Overview
Problem
Existing inductors face challenges in achieving high Rdc characteristics and reliability due to limitations in increasing the aspect ratio of coil patterns without risking plating deviations and short-circuits, primarily caused by the instability of insulators with limited thickness.
Innovation Solution
The inductor design includes a coil portion with an insulator having opening patterns that support coil patterns with a maximum thickness greater than the insulator, ensuring stable plating growth and preventing short-circuits by maintaining a specific thickness ratio and line width configuration, which enhances Rdc characteristics and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the aspect ratio of coil patterns is increased to improve inductance, then the inductance increases, but plating deviations and short-circuits occur due to insulator instability
Solution Approach 1:
The patent changes the thickness parameter of the insulator from a conventional uniform thin structure to a thick insulator structure where the insulator thickness is greater than the maximum thickness of the coil pattern. This parameter change stabilizes the insulator during plating processes, preventing plating deviations and short-circuits while allowing high aspect ratio coil patterns to be manufactured with improved reliability
Solution Approach 2:
The thick insulator acts as a preventive cushioning structure that anticipates and prevents potential short-circuits between coil patterns. By providing sufficient insulation thickness before the plating process occurs, the design prevents plating deviations and short-circuit defects that would otherwise occur with thinner insulators
2Reliability
If the insulator thickness is increased to prevent short-circuits, then reliability improves, but the aspect ratio of coil patterns is limited
Solution Approach 1:
The patent redefines the thickness parameter relationship by making the insulator thickness greater than the maximum coil pattern thickness, rather than using a thin insulator. This parameter change simultaneously achieves both goals: preventing short-circuits through sufficient insulation while allowing high aspect ratio coil patterns to be formed without limiting the coil geometry
3Volume of moving object
If thin insulators are used to maintain small device size, then miniaturization is achieved, but Rdc characteristics and reliability deteriorate
Solution Approach 1:
The patent changes the insulator thickness parameter to be greater than the coil pattern thickness, which optimizes the volume utilization. This parameter change improves Rdc characteristics and reliability by preventing short-circuits and plating deviations, while the overall device remains compact through efficient space utilization in the thick insulator structure
Data Source
AI summary
An inductor includes: a body including a coil portion; and an external electrode disposed on an external surface of the body, wherein the coil portion includes an insulator having an opening and a coil pattern filling the opening, and a maximum thickness of the coil pattern is greater than a thickness of the insulator in contact with a side surface of the coil pattern.