Inductor Magnetic Layer Openings for Uniform Leakage Paths
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Solution Overview
Problem
Inductor performance is compromised due to layer thickness variations in insulating layers formed by imprecise semiconductor processes like spin coating, leading to uneven magnetic leakage paths and inconsistent electrical performance.
Innovation Solution
Forming inductive devices with an insulating layer and magnetic layers where the magnetic layers connect at the edges, and creating magnetic leakage paths by precise openings in the upper magnetic layer instead of the insulating layer, using semiconductor processes for higher accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If insulating layers are formed by spin coating, then the manufacturing process is simple and fast, but the layer thickness varies leading to inconsistent electrical performance
Solution Approach 1:
The patent divides the insulating layer formation into multiple sequential deposition steps, where each step deposits a portion of the total insulating material. This segmentation allows better control over layer thickness uniformity while maintaining the simplicity and speed of spin coating, resolving the contradiction between manufacturing productivity and precision.
2Reliability
If magnetic layers are separated by insulating layers, then electrical insulation is provided, but magnetic leakage paths become uneven due to insulating layer thickness variations
Solution Approach 1:
The patent applies local quality by making the insulating layer selectively present in certain regions and absent in others. Specifically, the insulating layer is removed or not formed in regions where magnetic leakage paths need to be controlled, allowing uniform magnetic characteristics while maintaining electrical insulation where needed. This resolves the contradiction between electrical insulation reliability and magnetic leakage path stability.
3Manufacturing precision
If openings are formed in the insulating layer to provide magnetic leakage paths, then magnetic flux control is achieved, but the imprecise insulating layer formation causes inconsistent leakage path dimensions
Solution Approach 1:
The patent performs preliminary action by pre-defining the locations and dimensions of magnetic leakage paths through the insulating layer formation process itself, rather than relying on subsequent opening formation. The insulating layer is deposited with controlled thickness and patterned to create precise leakage paths before magnetic layers are formed, ensuring both electrical insulation integrity and consistent magnetic leakage path dimensions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces magnetic leakage path variations and allows for consistent performance across inductive devices, enabling tuning of performance characteristics to achieve optimal inductor performance.
Implementation Method 1
a lower magnetic layer and an upper magnetic layer that are formed such that the insulating layer does not separate the lower magnetic layer and the upper magnetic layer at outer edges or wings of the inductive device. The lower magnetic layer and the upper magnetic layer form a continuous magnetic layer around the insulating layer and the conductors of the inductive device
Implementation Method 2
Magnetic leakage paths are provided for the inductive device by forming openings in the upper magnetic layer
Data Source
AI summary
An inductive device includes an insulating layer, a lower magnetic layer, and an upper magnetic layer that are formed such that the insulating layer does not separate the lower magnetic layer and the upper magnetic layer at the outer edges or wings of the inductive device. The lower magnetic layer and the upper magnetic layer form a continuous magnetic layer around the insulating layer and the conductors of the inductive device. Magnetic leakage paths are provided by forming openings through the upper magnetic layer. The openings may be formed through the upper magnetic layer by semiconductor processes that have relatively higher precision and accuracy compared to semiconductor processes for forming the insulating layer such as spin coating. This reduces magnetic leakage path variation within the inductive device and from inductive device to inductive device.