Inductor Component with Magnetic Layers for Height Reduction

The patent applies local quality by replacing the insulating layer with a magnetic layer only in the region where the spiral conductor is present, while maintaining insulation through conductor embedding. The magnetic layer is positioned specifically beneath the spiral conductor to enhance inductance locally, rather than using a blanket insulating coverage that would prevent magnetic field enhancement.

The patent resolves this contradiction by transitioning from a single-layer thick substrate approach to a multi-layer stacked configuration. The spiral conductor is formed on a first substrate, then a magnetic layer is added, followed by another substrate layer. This layered approach in the vertical dimension allows each layer to be thinner while collectively achieving the required mechanical stability and magnetic performance, thereby reducing the overall height.

The patent segments the substrate function across multiple layers: the first substrate provides mechanical support and enables spiral conductor formation, the magnetic layer provides magnetic enhancement, and the second substrate provides additional mechanical support and protection. This segmentation allows each layer to be optimized for its specific function, with thinner individual layers that collectively provide the stability needed for precise spiral conductor formation while achieving overall height reduction.

The patent improves high-frequency current characteristics by adding the vertical dimension through a multi-layer conductor structure. The spiral conductor is formed as multiple stacked layers (first conductor layer and second conductor layer) separated by an insulating layer. This three-dimensional arrangement increases the effective conductor cross-section area, reducing electric resistance for high-frequency currents while maintaining a compact footprint that achieves high aspect ratio.