Packaged Inductor Module for Die Swaps Without Electrical Leakage
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Solution Overview
Problem
Existing semiconductor packages require tedious and expensive redesign and qualification procedures when swapping semiconductor dies, and are prone to issues like delamination, electromagnetic interference, and electrical shorts due to metal ions in magnetic mold compounds.
Innovation Solution
A semiconductor package design featuring a substrate, a second semiconductor package with metal contacts, a magnetic mold compound, and an inductor coil, where the second package interfaces with the substrate and includes a non-magnetic mold compound to prevent current leakage and electrical shorts, allowing for semiconductor die substitutions without additional qualification.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a magnetic mold compound is used to cover the semiconductor package, then electromagnetic interference is reduced and magnetic shielding is improved, but electrical shorts and current leakage may occur due to metal ions in the magnetic mold compound
Solution Approach 1:
A non-conductive barrier layer is introduced between the metal contacts and the magnetic mold compound. This intermediary layer prevents direct contact between metal ions in the magnetic mold compound and the metal contacts, thereby eliminating the harmful effect of electrical shorts while preserving the electromagnetic shielding benefits of the magnetic material.
Solution Approach 2:
The metal ions in the magnetic mold compound, which initially pose a risk of causing electrical shorts, are contained within the non-conductive barrier layer. This converts the potentially harmful metal ions into a benign presence, allowing the magnetic mold compound to provide electromagnetic shielding without compromising electrical isolation.
2Adaptability or versatility
If semiconductor die substitution is required, then design flexibility and adaptability are improved, but tedious redesign and qualification procedures are required
Solution Approach 1:
The package is divided into distinct functional segments: a first package containing the semiconductor die, and a second package providing the interface with the substrate. This segmentation allows the semiconductor die to be replaced independently without affecting the qualification status of the overall package, as only the replaceable first package needs to be swapped.
Solution Approach 2:
The second package is designed with universal interface characteristics that can accommodate different semiconductor dies. The standardized interface and packaging structure allow multiple different first packages to be substituted into the same second package without requiring redesign or re-qualification of the entire assembly.
3Quantity of substance
If metal contacts with small pitch are used on the semiconductor die, then device integration density is improved, but current leakage between contacts due to metal ions in magnetic mold compound increases
Solution Approach 1:
The non-conductive barrier layer serves as an intermediary between closely spaced metal contacts and the magnetic mold compound. This barrier prevents metal ion-induced current leakage even when contacts are densely packed, allowing high contact density to be achieved without compromising electrical isolation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables seamless substitution of semiconductor dies without repeating design and qualification processes, while preventing electrical shorts and leakage, thus reducing time and cost, and maintaining compliance with design specifications.
Implementation Method 1
a magnetic mold compound covering the substrate and the second semiconductor package
Implementation Method 2
the lead frame including second metal contacts having a second pitch; coupling the second package to a substrate; and covering the semiconductor package and the substrate with a magnetic mold compound. The second pitch prevents metal ions in the magnetic mold compound from causing current flow between successive ones of the second metal contacts
Data Source
AI summary
In examples, a semiconductor package comprises a substrate; a second semiconductor package coupled to the substrate, the second semiconductor package comprising a semiconductor die including first metal contacts coupled to second metal contacts of the second semiconductor package; a magnetic mold compound covering the substrate and the second semiconductor package, the magnetic mold compound contacting the second metal contacts; and an inductor coil having first and second terminals coupled to the substrate, the second semiconductor package in between the first and second terminals of the inductor coil.