Multi-Layer Inductor Device With Overlapping Sub-Wires

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Solution Overview

Problem

Existing inductor devices, such as spiral and eight-shaped inductors, face limitations in mutual inductance, coupling, and area efficiency, with eight-shaped inductors having low inductance value per unit area and limited application scope.

Innovation Solution

The proposed inductor device features a structure with multiple sub-wires and an eight-shaped inductor configuration, where wires are partially overlapped and arranged to enhance symmetry and inductance per unit area, including a first wire, second wire, third wire, and fourth wire with sub-wires disposed in specific areas and overlapping configurations.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If an eight-shaped inductor is used, then the coupling between coils is reduced, but the area occupied in the device increases

Engineering Contradiction:
Improvecoupling between coilsVSAvoidarea occupied
Core Design Contradiction:
ReliabilityVSArea of stationary object

Solution Approach 1:

The patent transitions from a planar eight-shaped inductor to a three-dimensional stacked configuration with multiple layers. The first and second inductors are positioned on different layers with partial overlapping, utilizing the vertical dimension to reduce lateral area occupation while maintaining effective coupling through controlled spatial arrangement.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent employs a nested structure where the third wire overlaps with the first wire and the fourth wire overlaps with the second wire in the vertical direction. This nesting approach allows multiple inductor components to occupy overlapping projection areas, effectively reducing the total device footprint while maintaining individual inductor performance.

Inventive Principle:
Principle #7Nested doll (Nesting)

2Stability of the object's composition

If a traditional stacked eight-shaped inductor is used, then symmetry is improved, but the inductance value per unit area is lower

Engineering Contradiction:
ImprovesymmetryVSAvoidinductance value per unit area
Core Design Contradiction:
Stability of the object's compositionVSProductivity

Solution Approach 1:

The patent applies local quality by creating asymmetric overlapping regions between wires on different layers. The third wire overlaps with the first wire in specific areas, and the fourth wire overlaps with the second wire in corresponding areas, optimizing the magnetic coupling locally to enhance inductance density while preserving overall structural symmetry.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The patent creates a composite inductor structure combining multiple wire types (first, second, third, and fourth wires) with different spatial arrangements and overlapping configurations. This composite approach allows optimization of both symmetry and inductance density by combining the advantages of different wire configurations in a unified multi-layer structure.

Inventive Principle:
Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The device achieves better symmetry and improved inductance value per unit area, with experimental results showing an inductance value of about 5.4 nH and a quality factor of 5.4 at 2.5 GHz within a 90 um*90 um area, expanding its scope of application.

Implementation Method 1

The first wire is disposed in a first area. The second wire disposed in a second area. The third wire is disposed in the first area and at least partially overlapped with the first wire in a vertical direction. The fourth wire is disposed in the second area and at least partially overlapped with the second wire in the vertical direction.

Methodology Applied
Scientific EffectElectromagnetic induction: Electromagnetic Induction

Data Source

PatentUS11387036B2Inductor device
Publication Date: 2022.07.12 REALTEK SEMICON CORP
  • US11387036B2 patent drawing
  • US11387036B2 patent drawing
  • US11387036B2 patent drawing

AI summary

An inductor device includes a first wire, a second wire, a third wire, a fourth wire, and an eight-shaped inductor structure. The first wire includes at least two first sub-wires. The second wire includes at least two second sub-wires. The third wire includes at least two third sub-wires. The fourth wire includes at least two fourth sub-wires. The first wire is disposed in a first area. The second wire is disposed in a second area. The third wire is disposed in the first area and at least partially overlapped with the first wire in a vertical direction. The fourth wire is disposed in the second area and at least partially overlapped with the second wire in the vertical direction. The eight-shaped inductor structure is disposed on an outer side of the third wire and the fourth wire.