Inductor Package Stacking With Coplanar Mounting Surfaces
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Solution Overview
Problem
Large inductors in semiconductor packages face challenges with high Z-axis height tolerance, asymmetric electrodes, and non-symmetric surfaces that complicate surface-mounting on circuit boards, leading to inefficient sequential assembly processes.
Innovation Solution
A package structure with independent first and second modules, where the inductor and interconnection component are stacked, with soldering balls ensuring coplanar surfaces and adjusted solder paste consumption for flat interconnection, allowing simultaneous packaging of both modules.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If sequential assembly process is used for chips and inductors, then assembly is simpler, but production efficiency is lower
Solution Approach 1:
The patent merges the assembly of chips and inductors into a single simultaneous assembly process. Both components are assembled onto the substrate at the same time using the same equipment and process steps, eliminating the need for separate sequential assembly operations while maintaining assembly simplicity.
Solution Approach 2:
The patent prepares both chips and inductors in advance with compatible mounting structures and positioning features. By pre-configuring both components to be mountable simultaneously with the same positioning and fixation methods, the assembly process can proceed in parallel without requiring complex intermediate steps or repositioning operations.
2Reliability
If inductor with large Z height tolerance is used, then inductor performance is better, but surface-mounting precision is worse
Solution Approach 1:
The patent introduces an intermediate mounting structure or positioning mechanism that decouples the inductor's Z-height tolerance from the final mounting precision. This intermediary element absorbs or compensates for height variations, allowing the inductor to be mounted with relaxed tolerance while achieving precise final positioning through the intermediary's corrective function.
Solution Approach 2:
The patent changes the mounting parameters or specifications to accommodate large Z-height tolerance. This may involve adjusting the mounting hole dimensions, using compliant mounting structures, or modifying the fixation method to be less sensitive to height variations, thereby enabling precise surface-mounting despite the inductor's inherent tolerance.
3Adaptability or versatility
If asymmetric electrodes on inductor are used, then inductor design flexibility is better, but circuit board mounting difficulty increases
Solution Approach 1:
The patent deliberately designs the inductor with asymmetric electrodes that correspond to the asymmetric layout requirements of the circuit board. By making the asymmetry explicit and intentional in the design phase, the mounting process becomes simpler as the asymmetric features directly match the board layout, eliminating the need for complex orientation or adaptation during assembly.
Solution Approach 2:
The patent applies different local qualities or characteristics to different parts of the inductor's electrode structure. Specific regions of the inductor are designed with particular electrode configurations optimized for their local mounting requirements, allowing each area to be mounted optimally according to its specific needs while maintaining overall design flexibility.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies the assembly process, improves production efficiency, and enhances the reliability of the package structure by enabling synchronous manufacturing and ensuring coplanar connections.
Implementation Method 1
The first package carrier is electrically connected to the second package module by soldering balls disposed on the second surface. The inductor and the interconnection component are electrically connected with each other by the soldering balls on the first surface thereof
Data Source
AI summary
The present invention provides a package structure with an inductor and a manufacturing method thereof, the inductor and the interconnection component are used as n second package module, and stacked with other components such as the first package module to form a stack-like package structure. The first package module is provided with other electronic elements. Then the first and second package modules can be synchronously subjected to package manufacturing, which improves the production efficiency. Additionally, the soldering balls with different heights are formed on the first faces of the interconnecting structural component and the inductive device by adjusting the consumption of soldering paste, which make the second faces of the inductor and the interconnection component are coplanar, then inductor with different heights can form a flat interconnecting plane, which makes the sequential process such as pasting and mounting can be conveniently performed. The process is simplified, and the reliability of the package structure is improved.