Inductor Structure on Package Substrate for TWS Headphones
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Solution Overview
Problem
Existing true wireless stereo (TWS) headphones have bulky inductors mounted on printed circuit boards (PCBs), which increase complexity and cost, and make it difficult to reduce the volume and improve integration due to the need for separate assembly and large space occupation.
Innovation Solution
The integration of an inductor structure with a package substrate and a sensing chip, using ball grid array (BGA) packaging to connect the substrate and motherboard, allowing for reduced volume and simplified assembly by facilitating electrical connections through solder balls and flip-chip bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If bulky inductors are mounted on separate PCBs, then inductor functionality is achieved, but device volume increases and integration is reduced
Solution Approach 1:
The patent merges the inductor structure with the package substrate by forming the inductor directly on the substrate using conductive materials. This integration eliminates the need for separate inductor components and their mounting, thereby reducing overall device volume while improving integration. The inductor is now part of the substrate structure itself rather than a separate mounted component.
2Ease of manufacture
If separate PCB mounting is used for inductors, then assembly is simplified, but manufacturing complexity and cost increase
Solution Approach 1:
By forming the inductor structure directly on the package substrate during the substrate fabrication process, the patent eliminates separate inductor mounting operations. The inductor is created as an integral part of the substrate through conductive material deposition and patterning, which simplifies the overall manufacturing process by reducing the number of assembly steps and components.
3Area of stationary object
If traditional PCB mounting is used, then electrical connections are established, but space occupation increases
Solution Approach 1:
The patent transitions from a traditional three-dimensional mounting approach (separate inductor component mounted on PCB surface) to a planar integration approach where the inductor is formed directly on the substrate in the same plane. This dimensional reorganization allows the inductor structure to occupy minimal space while maintaining electrical connection functionality through the substrate's conductive pathways.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution reduces the space occupied by the inductor structure, enhances integration, and simplifies the assembly and operation of TWS headphones, while maintaining effective deformation sensing and operation control.
Implementation Method 1
The inductor structure is on a first surface of the package substrate configured to sense a deformation of the TWS headphone... sensing, by an inductor structure, a deformation of the TWS headphone... sensing, by a sensing chip, an inductance change in the inductor structure
Data Source
AI summary
Embodiments of the present disclosure provide an integrated circuit package in a true wireless stereo (TWS) headphone. The integrated circuit package includes a package substrate, an inductor structure, a sensing chip, and a semiconductor device. The inductor structure is on a first surface of the package substrate configured to sense a deformation of the TWS headphone. The sensing chip is attached to a second surface of the package substrate and configured to sense an inductance change in the inductor structure. The semiconductor device is attached to the second surface of the package substrate configured to process a sensed inductance change.