Inductor Integration in Packaged ICs via Bond Wire Solenoids
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Solution Overview
Problem
The challenge is to incorporate high power resistors, large capacitors, and large inductors into integrated circuits or their packages, which is often not feasible due to space constraints, leading to these components being attached to circuit boards, consuming valuable area and increasing manufacturing costs.
Innovation Solution
The integration of inductors is achieved by forming bond wires and metal traces around the integrated circuit, creating a solenoid-like structure that wraps around the circuit, allowing for inductance to be implemented directly within the package, reducing the need for external components and saving circuit board space.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If inductors are attached to circuit board externally, then inductance function is achieved, but circuit board area is consumed and manufacturing cost increases
Solution Approach 1:
The patent merges the inductor with the integrated circuit package by forming bond wires that extend from the IC and trace patterns on the package substrate, creating an integrated inductor-IC assembly. This eliminates the need for separate external inductor components and their associated circuit board mounting, thereby reducing circuit board area and manufacturing complexity.
Solution Approach 2:
The inductor structure is nested within the integrated circuit package boundaries. The bond wires extend from the IC die, loop through the package substrate, and connect back to the IC, effectively nesting the inductor function inside the existing package footprint without requiring external attachment to the circuit board.
2Area of stationary object
If inductors are integrated into the packaged circuit, then circuit board area is saved, but space constraints within the package make integration difficult
Solution Approach 1:
The patent utilizes the three-dimensional space within the package by having bond wires extend vertically from the IC die, loop through the package substrate thickness, and return to the IC. This vertical dimension utilization allows inductor integration without consuming additional planar area on the circuit board or requiring excessive lateral space within the package.
Solution Approach 2:
The bond wires serve dual functions: providing electrical interconnections between the IC die and package substrate, and simultaneously forming the inductor structure. This multi-functionality eliminates the need for separate inductor components and reduces overall package complexity despite the added inductor function.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for the integration of inductors within the packaged integrated circuit, reducing circuit board area usage and manufacturing costs, while providing a cost-effective and space-efficient solution for portable electronic devices.
Implementation Method 1
forming bond wires and metal traces around the integrated circuit, creating a solenoid-like structure that wraps around the circuit, allowing for inductance to be implemented directly within the package
Data Source
AI summary
Packaged integrated circuits having inductors and methods to form inductors in packaged integrated circuits are disclosed. An example method comprises forming a substrate having a first trace and a contact, attaching an integrated circuit to the substrate over the first trace, and electrically coupling the first trace to the contact via an electrical conductor that extends over the integrated circuit to form the inductor in the packaged integrated circuit.