Inductor Component in Printed Wiring Board via Magnetic Layer
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Solution Overview
Problem
Existing printed wiring boards with integrated inductor components face challenges in achieving high inductance and Q factor without increasing the thickness or warping due to the number of conductive patterns and insulation layers, and there is a need for improved connection reliability between conductive patterns and magnetic layers.
Innovation Solution
A printed wiring board design featuring a core base with an opening for an inductor component, filled with a filler resin, and interlayer insulation layers comprising magnetic and resin materials with penetrating holes, where via conductors connect conductive patterns through the resin layers, enhancing magnetic permeability and connection reliability without direct contact with magnetic layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple conductive patterns and insulation layers are added to increase inductance, then inductance increases, but board thickness increases and warping occurs
Solution Approach 1:
The patent applies composite materials by integrating a magnetic layer containing magnetic particles within the interlayer insulation layer. This magnetic layer enhances the inductance of the inductor component without requiring additional conductive patterns or insulation layers, thereby increasing inductance while maintaining board thickness within acceptable limits.
Solution Approach 2:
The magnetic layer is selectively positioned only in the region where the inductor component is located, specifically within the interlayer insulation layer surrounding the coil pattern. This localized application of magnetic material enhances inductance where needed without adding overall board thickness or causing warping across the entire board.
2Reliability
If via conductors directly contact magnetic layers, then connection reliability improves, but manufacturing complexity increases
Solution Approach 1:
The patent introduces a resin layer as an intermediary between the via conductor and the magnetic layer. The via conductor is formed within a penetrating hole that passes through the resin layer, which covers the magnetic layer. This intermediary resin layer simplifies the manufacturing process by eliminating the need for direct contact between the via conductor and magnetic layer, while still ensuring reliable electrical connection through the resin medium.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design allows for a thin printed wiring board with high inductance and improved connection reliability, reducing warping and achieving required inductance characteristics with fewer layers, while maintaining enhanced adhesiveness and connection reliability of via conductors.
Implementation Method 1
the interlayer insulation layer of the inductor component includes a magnetic layer and a resin layer covering the magnetic layer, the magnetic layer of the interlayer insulation layer in the inductor component includes a magnetic material and a resin material
Data Source
AI summary
A printed wiring board has a core base having an opening portion, an inductor component accommodated in the opening portion, and a filler resin filling gap between the component and a side wall of the opening portion. The component has a support layer, a first conductive pattern on the support, an interlayer insulation layer on the support and first pattern, a second conductive pattern on the insulation layer, and a via conductor in the insulation layer and connecting the first and second patterns, the insulation layer includes a magnetic layer and a resin layer covering the magnetic layer, the magnetic layer includes magnetic material and resin material and has a first hole, the insulation layer has a second hole penetrating through the resin layer such that the second hole passes through the first hole and extends to the first pattern, and the via conductor is formed in the second hole.