Inductor Component Pin-Cavity Assembly for Miniaturized High-Yield Production
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Solution Overview
Problem
The existing methods for producing inductor components face challenges in miniaturization and production efficiency, with low yield rates and quality stability, particularly when dimensions are reduced below 2 mm, leading to high manufacturing costs and defects such as cracking and short circuits.
Innovation Solution
The inductor component design includes a conductive structure with two spaced conductive pins connected to a magnetic core through accommodating cavities, covered by a covering layer, allowing for mass production and improved quality consistency, with a yield rate exceeding 99.9% and reduced defective products.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If integral molding method is used to produce miniaturized inductor components, then production efficiency is improved, but yield rate deteriorates (low quality stability with cracking, short circuits, and open circuits)
Solution Approach 1:
The patent divides the inductor component into separate modules: the magnetic core is prepared independently with pre-formed accommodating cavities, and the conductive structure (winding) is prepared separately then inserted into the magnetic core. This segmentation allows each part to be optimized independently, avoiding the defects of integral molding while maintaining high production efficiency through parallel processing of multiple components.
Solution Approach 2:
The accommodating cavities are pre-formed in the magnetic core before the conductive structure is inserted. This preliminary action ensures proper positioning and alignment, preventing defects such as misalignment, cracking, and open circuits that occur in integral molding. The conductive structure is also prepared in advance with predetermined geometry, enabling consistent quality across batches.
2Length of moving object
If inductor component width is reduced below 2 mm for miniaturization, then device size is improved, but manufacturing cost deteriorates (low yield rate and quality stability)
Solution Approach 1:
By segmenting the manufacturing process into separate preparation of magnetic core and conductive structure, the patent enables precise control of each component's dimensions. The accommodating cavities are drilled or formed with high precision, and the conductive structure is fabricated to exact specifications, ensuring consistent quality even at widths below 2 mm without incurring high costs.
Solution Approach 2:
The patent changes the manufacturing parameters by using independent preparation methods with controlled dimensions. The magnetic core is formed with specific cavity dimensions, and the conductive structure is fabricated with controlled cross-sectional area and geometry. This parameter control allows miniaturization while maintaining manufacturing economy through standardized processes.
3Strength
If conventional winding formation method is used, then structural integrity is improved, but device complexity increases (limiting miniaturization)
Solution Approach 1:
The patent extracts the winding formation process from the bulk material and uses separate conductive structures with pins that are inserted into the magnetic core. This extraction simplifies the overall structure by eliminating complex integrated winding formations while maintaining structural integrity through the pin insertion and accommodating cavity design. The conductive structure can be a simple strip or wire form rather than complex pressed windings.
Data Source
AI summary
An inductor component includes at least one conductive structure, a magnetic core, and a covering layer. Each conductive structure includes a conductive body and two conductive pins, the two conductive pins are spaced apart in a first direction, the first direction is an extension direction of the conductive body, and the two conductive pins extend in a second direction and are connected to the conductive body. The magnetic core is provided with at least two accommodating cavities. The two conductive pins are respectively inserted into accommodating cavities to connect the each conductive structure to the magnetic core, and the two conductive pins are in a one-to-one correspondence with the accommodating cavities. The covering layer is disposed on a side of the conductive body of the each conductive structure away from the two conductive pins and is configured to cover the each conductive structure.