Inductor Formation on Polymer Matrix Composite Substrate
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Solution Overview
Problem
The existing semiconductor manufacturing process for forming inductors is complex and costly due to the use of sacrificial substrates, which require additional processing steps like grinding and etching.
Innovation Solution
The use of a polymer matrix composite substrate with a first insulating layer and an interconnect structure allows for the formation of inductors without the need for sacrificial substrates, simplifying the manufacturing process and reducing costs by eliminating the need for grinding and etching steps.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a sacrificial substrate is used to form an inductor, then the inductor can be formed with structural support, but additional processing steps (grinding and etching) are required, increasing manufacturing complexity and cost
Solution Approach 1:
The patent extracts and eliminates the sacrificial substrate from the manufacturing process. Instead of using a temporary substrate that must be removed through grinding and etching, the invention forms the inductor directly on the final substrate, removing the unnecessary intermediate step and its associated complexity
Solution Approach 2:
The patent performs preliminary preparation of the substrate surface through chemical mechanical polishing to achieve the required flatness and roughness parameters before inductor formation. This preliminary action eliminates the need for post-substrate removal processing, as the substrate is prepared in advance to directly support the inductor structure
2Ease of manufacture
If a sacrificial substrate is used for inductor formation, then structural support is provided during manufacturing, but grinding and etching steps are required, increasing manufacturing cost
Solution Approach 1:
The sacrificial substrate step is completely extracted from the process flow. The invention uses the final substrate directly as the support during inductor formation, eliminating the time-consuming sequence of substrate deposition, inductor formation, then substrate removal through grinding and etching
Solution Approach 2:
The substrate undergoes preliminary chemical mechanical polishing to achieve target surface properties (flatness within 0.5 mils, roughness Ra 50-200 micro-inches) before inductor formation. This advance preparation eliminates subsequent time-consuming removal steps while providing necessary structural support throughout the manufacturing process
Data Source
AI summary
A semiconductor device has a first insulating layer formed over a first surface of a polymer matrix composite substrate. A first conductive layer is formed over the first insulating layer. A second insulating layer is formed over the first insulating layer and first conductive layer. A second conductive layer is formed over the second insulating layer and first conductive layer. The second conductive layer is wound to exhibit inductive properties. A third conductive layer is formed between the first conductive layer and second conductive layer. A third insulating layer is formed over the second insulating layer and second conductive layer. A bump is formed over the second conductive layer. A fourth insulating layer can be formed over a second surface of the polymer matrix composite substrate. Alternatively, the fourth insulating layer can be formed over the first insulating layer prior to forming the first conductive layer.