3D Inductor Structure with Polymer Insulation
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Solution Overview
Problem
The challenge lies in fabricating inductor structures with high inductance in a miniaturized form factor within semiconductor processes, as conventional methods struggle with planar process limitations and thermal stability of insulation materials.
Innovation Solution
The development of an inductor structure featuring a long trapezoidal polymer prism insulation layer with an arched upper surface and rounded corners, supported by two magnetic material layers, which allows for smooth film deposition and maintains magnetic characteristics, enabling high inductance integration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional planar process techniques are used to fabricate inductor structures, then manufacturing simplicity is maintained, but inductance value and magnetic characteristics deteriorate due to inability to form three-dimensional wrapped structures
Solution Approach 1:
The patent transitions from conventional planar (2D) inductor structures to a three-dimensional (3D) configuration where magnetic material layers are wrapped around a cylindrical insulation structure. This dimensional change enables the formation of a stripline-type inductor with superior magnetic characteristics and higher inductance values that cannot be achieved with planar processes alone.
Solution Approach 2:
The inductor structure is divided into distinct segments: a cylindrical insulation structure, first and second magnetic material layers wrapped around it, and conductive wires passing through the insulation. This segmentation allows each component to be optimized independently while maintaining overall manufacturing feasibility through sequential fabrication steps.
2Shape
If thermal reflow process is used to form cylindrical insulation structure, then three-dimensional structure is achieved, but insulation material thermal stability is compromised due to material degradation
Solution Approach 1:
The patent changes the thermal parameters of the reflow process, specifically controlling the reflow temperature to be below the glass transition temperature of the insulation material. This parameter adjustment allows the formation of the cylindrical insulation structure through self-aligned reflow without causing material degradation, thereby maintaining both structural formation capability and material thermal stability.
3Productivity
If planar process techniques are used, then process simplicity is maintained, but inductance density and on-die integration capability deteriorate
Solution Approach 1:
By transitioning to 3D wrapped structures, the patent achieves higher inductance density within a smaller footprint, enabling effective on-die or on-package integration. The vertical stacking and wrapping of magnetic layers around the cylindrical insulation structure maximize the use of available space, significantly improving inductance density compared to planar configurations.
4Manufacturing precision
If rounded corners are formed on the insulation structure, then film deposition smoothness is improved, but manufacturing precision requirements increase
Solution Approach 1:
The patent employs a self-aligned reflow process where the insulation material automatically forms rounded corners through capillary action and surface tension during the reflow step. This self-service mechanism eliminates the need for separate corner rounding operations, achieving smooth film deposition surfaces while maintaining manufacturing simplicity through the inherent physics of the reflow process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively achieves high inductance in integrated inductors and transformers, ensuring efficient magnetic characteristics and manufacturability within the constraints of semiconductor processes, while reducing gravitational force effects on magnetization polarity.
Implementation Method 1
The insulation layer includes a polymer structure... formed by coating a photoresist material, performing a first settlement, performing a pattern definition with lithography on the photoresist material, performing a second settlement, and developing the photoresist material
Implementation Method 2
reducing gravitational force effects on magnetization polarity
Data Source
AI summary
The present disclosure relates to inductor structures and fabricating methods. One example inductor structure includes a first magnetic material layer, an insulation layer, where the insulation layer comprises a polymer structure with longitudinal length which greater than lateral length, the polymer structure comprises an arched upper surface, a first side surface, a second side surface, a bottom surface in a longitudinal direction, at least one of a corner between the arched upper surface and the first side surface and a corner between the arched upper surface and the second side surface is a rounded corner, and at least one of an angle formed between the first side surface and the bottom surface and an angle formed between the second side surface and the bottom surface is less than 90 degree, at least one conductive wire structure passing through the insulation layer, and a second magnetic material layer.